Ultra-low power 32 kHz RC oscillator designed in GlobalFoundries 22FDX
Innovative Logic Announced Licensing of Their USB3.1 SuperSpeedPlus Dual Role IP
San Jose – January 26, 2016 – Innovative Logic Inc.(Inno-Logic, www.inno-logic.com), a leading provider of reusable standard based Intellectual Property (IP) and ASIC/FPGA design & verification services announced today the release of their USB3.1 dual role IP. After having great success in adoption of Inno-Logic’s USB3.0 device and host controller IP, this is a one big step to provide the upgrade to USB3.1 IP.
Inno-Logic’s USB3.1 dual role device and host solution has gone through extensive pre and post silicon tests to ensure that it works seamlessly at the customer end. We have also tested our IP using more than 8 PHY vendors and more than 4 VIP vendors globally.
Key Features
- Fully compliant with USB 3.1 specification v1.0.
- Fully compliant with USB3.1 PIPE specification.
- Fully tested with most of popular PHYs currently available
- Fully validated with most of popular VIPs currently available
- Supports all transfer types – Control, Bulk, Isochronous and Interrupt transfers.
- Supports up to 15 IN & 15 OUT functional endpoints along with a default control endpoint.
- Supports industry standard 32/64 bit bus interface – AMBA AHB/AXI.
- System Verilog based coverage driven verification.
The Innovative Logic USB3.1 controller will enable users to download data up to 10.0 Gbits/sec (Super-Speed Plus mode). This will allow users to comfortably transfer data between high-end devices such as 4K videos, high resolution HD pictures, large software database in far lesser time compared to older technology. Typical USB3.1 based applications are removable hard drives, flash drives, high-end video and imaging devices, 4K displays, high-resolution HD printer/scanner, etc.
Our USB3.1 dual role IP is currently available for licensing worldwide for early adopters. The IP is currently available in both soft IP and FPGA netlist formats. The soft IP deliverables include RTL source code, test vectors, scripts, basic device drivers and User Manual. The FPGA netlist deliverables include test vectors, scripts, User Manual along with the FPGA netlist.
For details about the licensing USB 3.1 dual role IP, please contact at sales@inno-logic.com or call our nearest Design Center. For details, visit our website at www.inno-logic.com.
About Innovative Logic Inc.
Innovative Logic is the leading provider of reusable standard based IP solutions as well as high quality and reliable design services in ASIC, FPGA and Embedded Software. Innovative Logic has a world class team of engineers who have successfully executed different projects using the latest tools and the technologies.
|
Related News
- Innovative Logic Inc. and M31 Technology Introduce a USB-IF Certified Complete SuperSpeed USB 3.0/2.0 Dual Role IP Solution
- Genesys Logic Announces USB3.1 Gen 2 Hub Controller with Multiple Upstream Port Support and USB-C Integrated
- Fresco Logic Charges Ahead with USB Type-C Applications and Power Delivery
- Arasan Announces immediate availability of its I3C Host / Device Dual Role Controller IP
- Innovative Logic USB IP Portfolio Strengthens RISC-V Ecosystem
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |