Qualcomm, CEVA, ARM Race to Next-Gen Modem
Junko Yoshida, EETimes
2/17/2016 07:01 PM EST
PARIS—Advancements of LTE technology, including LTE Advanced and LTE Advanced Pro, are creating havoc. They are spawning a host of new demands that make the next-gen baseband designs far more complex than any of the previous smartphone modems.
The world’s leading telecom chip vendor Qualcomm, CEVA, a DSP core supplier, and ARM, a processor core company, are all racing to meet that challenge. They have developed new processor architectures, which they are unveiling in prior to the Mobile World Congress next week. Qualcomm announced Snapdragon X16 last week, while CEVA this week revealed CEVA-X4 and ARM is now talking up its new Cortex-R8. Qualcomm for the first time deploys its own DSP core in the new modem, instead of ARM.
E-mail This Article | Printer-Friendly Page |
Related News
- Bringing Arm TCS23 to Life on Next-gen Flagship Smartphones with MediaTek and vivo
- NVIDIA Collaborates With SoftBank Corp. to Power SoftBank's Next-Gen Data Centers Using Grace Hopper Superchip for Generative AI and 5G/6G
- Arm announces new "Automotive Enhanced" processor designed for safe next-gen driver experiences
- VirtualLogix VLX Virtualization Software Now Integrates with Cortex A15, Enabling Mobile Device Manufacturers to Begin Next-Gen Designs Today
- ARM in partner discussions over next-gen architecture
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
Most Popular
- Qualitas Semiconductor and Ambarella Sign Licensing Agreement
- ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Intel and Arm Team Up to Power Startups
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024