MegaChips Selects S3 Group Data Converter IP
DUBLIN & OSAKA, Japan-- February 23, 2016--S3 Group today announced that MegaChips Corporation has selected Data Converter IP from its Magellan family of high-speed Digital to Analogue Converters (DAC), to enable its customers to develop optimized next generation connected consumer Systems on Chip (SoCs).
S3 Group’s Magellan family of high-speed data converters provide optimal performance targeted for highly integrated connected consumer SoC’s, such as those requiring LTE-A, WiFi (802.11x), DVB or next generation DSL connectivity. The Magellan family is now available from multiple tier-one foundries and in several process nodes; these converters deliver excellent dynamic linearity performance with low distortion, while consuming ultra-low power and occupying exceptionally small silicon footprints.
“MegaChips decision to select S3 Group’s Magellan family of high-speed converters was based on the specific IP performance objectives, application knowledge and the recognized high quality delivery. In addition, their integration expertise greatly complements our development team during the system specification and chip implementation phases” said Masahiro Konishi, General Manager of Communication Dept., SoC/ASIC & Industrial Div. at MegaChips.
“At S3 Group we continue to support our customers who are at the forefront of product innovation by providing optimized performance, with the lowest power and smallest area, providing our customers with a definable market lead. We are delighted to enable MegaChips provide optimized, quick turn-key solutions to their customers, in their most advanced process nodes” said Darren Hobbs, Director of Product Management Semiconductor Solutions at S3 Group.
About S3 Group:
S3 Group delivers RF and Mixed Signal IP and tailored silicon solutions to Semiconductor companies, OEMs and Service Operators. The company is one of the longest serving independent silicon design solution providers in the industry and has built a wealth of experience and engineering expertise as well as an enviable delivery track record over more than 29 years. S3 Group provides a comprehensive portfolio of RF and mixed-signal IP, in addition to custom ASIC design services. The IP portfolio includes high performance ADC and DAC converters, PLLs, Analog Front Ends (AFEs), Power Management, RF Transceivers and other miscellaneous circuits which are silicon proven at a variety of foundries (including TSMC, Global Foundries, SMIC and UMC amongst others) at nodes ranging from 180nm to 28nm. Global end markets served by S3 Group clients include Consumer Mobility, Consumer, Satellite Communications, Communications Infrastructure, Automotive, and Industrial. Founded in 1986, S3 Group, headquartered in Dublin, Ireland, has development centres in US, Ireland, Poland, the Czech Republic and Portugal with sales offices and representatives worldwide.
For further information please visit www.s3group.com/semiconductor-solutions and www.twitter.com/S3Group_Silicon
About MegaChips
MegaChips (Tokyo Stock Exchange:6875) was the first fabless LSI company in Japan and has been developing innovative silicon solutions for over 25 years. Our expertise in systems and applications has created State of the Art SoCs and ASICs for the gaming, imaging, audio and telecommunications markets. MegaChips low power technology combined with our original algorithms and SoC capability are resulting in a new generation of Mobile, Wearable devices and IoT applications that are meeting the current and future needs of an integrated world. To meet the ever changing market needs MegaChips has a dedicated world-wide organization focused on defining and developing new products and technologies needed to provide ASSP and ASIC solutions for our customers and partners. MegaChips is headquartered in Japan, the technical development base in the US, sales and technical support center in China and Taiwan, and R&D hub in India.
For additional information, please visit:
http://www.megachips.co.jp/english/index.html
|
Related News
- S3 Group's Video Data Converter IP Selected by GEO Semiconductor
- S3 Group ICs Drive New Iridium 9602 Satellite Data Transceiver
- Omni Design Technologies Delivers Multi-Gigahertz SWIFT™ Data Converter Solutions for Satellite Communications
- Omni Design Technologies Extends Swift™ Data Converter Solutions for FR1 and FR2 5G Subsystems
- Omni Design Technologies extends partnership with EnSilica and expands Swift™ Data Converter IP portfolio
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |