eMemory Announces Industry's First 16nm FinFET Compact (FFC) Process Verified OTP Silicon IP
Hsinchu, Taiwan (Mar. 14, 2016) – eMemory announces today that its OTP technology NeoFuse has been verified in 16nm FinFET Compact process (16FFC), marking an important milestone as the world’s first IP provider to deliver a logic NVM solution in the cutting-edge 16FFC process platform. The rapid and successful development of NeoFuse technology in 16FFC process will facilitate product migration from 16nm FinFET Plus process (16FF+) to 16FFC.
eMemory’s NeoFuse technology features low voltage with robust memory cell structure that expedites NVM IP availability for the new process platform. As process migrates from 16FF+ to 16FFC, the features of NeoFuse IPs are remained and enhanced to minimize the impact on existing product usage. This demonstrates the benefits of excellent porting flexibility for process migration.
16FFC has been announced as the most power-efficient solution for ultra-low power wearable devices and IoT applications, and it will be entering risk production in 2016. We expect NeoFuse IP will be embedded widely in ultra-low power applications such as wearables, mobile devices, and consumer electronics owing to its early-stage IP readiness.
eMemory’s NeoFuse has passed silicon verification in 16FFC process platform and is expected to complete qualification in the third quarter of 2016, providing customers with the same specifications that are available in 16FF+. As the 16nm process continues to evolve, eMemory will follow the latest developments closely to provide customers with the most comprehensive solutions.
About eMemory:
eMemory (Stock Code: 3529) is a global leader in logic process embedded non-volatile memory (eNVM) silicon IP. Since established in 2000, eMemory has been devoted to research and development of innovative technologies, offering the industry’s most comprehensive platforms of patented eNVM IP solutions include NeoBit (OTP Silicon IP), NeoFuse (Anti-Fuse OTP Silicon IP), NeoMTP (1,000+ Times Programmable Silicon IP), NeoFlash (10,000+ Times Programmable Silicon IP), and NeoEE (100,000+ Times Programmable Silicon IP) to semiconductor foundries, integrated devices manufacturers (IDMs) and fabless design houses worldwide. eMemory’s eNVM silicon IPs support a wide range of applications include trimming, function selection, code storage, parameter setting, encryption, and identification setting. The company has the world’s largest NVM engineering team and prides itself on providing partners a full-service solution that sees the integration of eMemory eNVM IP from initial design stages through fabrication. For more information about eMemory, please visit www.ememory.com.tw.
|
Related News
- eMemory Announces the First Verified NeoFuse OTP IP in 16nm FinFET Plus Process
- eMemory's NeoFuse IP Verified in TSMC 10nm FinFET Process
- eMemory NeoFuse Technology Is Verified in 16nm FinFET Process
- eMemory's Security-Enhanced OTP Qualifies on TSMC N5A Process Specializing in High-Performance Automotive Chips
- eMemory's Security-Enhanced OTP Qualifies on TSMC N4P Process, Pushing Forward in High-Performance Leading Technology
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |