Acorn Technologies Licenses hellaPHY to Sequans Communications
Acorn’s hellaPHY family of IP cores for IoT to CAT 15 devices
LA JOLLA, Calif., March 17, 2016 – Acorn Technologies, Inc., a semiconductor and telecom company, today announced that Sequans Communications (NYSE: SQNS), a 4G chipmaker and leading provider of single-mode LTE chipset solutions to wireless device manufacturers worldwide, has licensed the company’s hellaPHY for LTE. Sequans Communications is considering hellaPHY for use in future products.
“We are always exploring techniques to improve performance and power efficiency as we look to meet future 3GPP standards requirements and the needs of a diverse range of IoT applications. Acorn Technologies has developed a collection of IP blocks that are helpful in this regard,” said Bertrand Debray, COO, Sequans.
“Our hellaPHY IP cores will help to enable features such as indoor location services in a power efficient manner for IoT to CAT 15 devices that are compliant with FCC E-911 mandates as well as provide spectral efficiency enhancements that improve network throughput. We’re delighted to be working with Sequans.” said Tom Horgan, CEO, Acorn Technologies.
Acorn’s hellaPHY is a suite of advanced receiver IP cores that make the wireless experience better and significantly improve spectral efficiency. The hellaPHY suite includes unique channel estimation and parameter estimation algorithms that are well suited for LTE advanced features and beyond. These features include accurate OTDOA positioning, eMBMS, CoMP and Massive MIMO. The accuracy these algorithms provide in increasingly challenging operating environments will have benefits well beyond 4G and address critical needs for the upcoming 5G standards.
About Sequans Communications
Sequans Communications S.A. (NYSE: SQNS) is a 4G chipmaker and leading provider of single-mode LTE chipset solutions to wireless device manufacturers worldwide. Sequans offers two LTE product lines: StreamrichLTE™, optimized for feature-rich mobile computing and home/portable router devices, and StreamliteLTE™, optimized for M2M and IoT (Internet of Things) devices. Sequans is based in Paris, France with additional offices in the United States, United Kingdom, Israel, Hong Kong, Singapore, Taiwan, South Korea, and China. Visit Sequans online at www.sequans.com
About Acorn Technologies
Acorn Technologies is leading provider of performance scaling semiconductor and mobile computing innovations and has a significant portfolio of technologies that address technology performance at the base of the semiconductor and telecom markets. These include improved silicon strain and low contact resistance technologies to improve semiconductor transistor performance, spectral efficiency, interference rejection, and enhanced location based IP for 4G wireless. With nearly 200 patents issued and applied for in the fields of semiconductor process and wireless communication, Acorn Technologies is bringing innovation and IP to address the fundamental building blocks for high performance mobile computing and wireless semiconductor devices. For more information, visit www.acorntech.com.
|
Related News
- 4G Chipset Provider Sequans Communications Licenses MIPS Technologies' Processor Core
- Sequans Communications Licenses LSI Logic ZSP(R) DSP Core for Broadband Wireless Market
- Sequans Announces a New $15 Million Licensing Agreement
- Sequans Provides Statement on Renesas Termination of MOU and Announces Conference Call to Review Fourth Quarter and Full Year 2023 Results and Outlook for Full Year 2024
- Sequans Introduces Taurus 5G NR: The World's First Chipset Specifically Optimized for 5G Broadband IoT Devices
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |