Jessica Lipsky, EETimes
4/22/2016 10:27 AM EDT
SAN FRANCISCO—Officials from Samsung Semiconductor Inc. (SSI) detailed the company’s foundry roadmap, which includes expanding FD-SOI production and offering low-cost alternatives to existing FinFET technologies.
Perhaps the most relevant announcement is the development of a low-cost 14nm FinFET process, 14nm LPC. The company has already shipped more than half a million 14nm wafers and expanded the process to included networking/server and automotive applications, but Samsung’s Kelvin Low said he expects next-generation applications to move to the lower-cost option.
“There are always concerns about trading off cost versus performance,” Low, Samsung’s senior director of foundry marketing, told EE Times. “LPC has the same PDK of [14nm] LPP. The number of steps has been reduced…That allows us to achieve a lower cost point on manufacturing and we decide to share that with our customers.”
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