Xilinx Board Of Directors Increases Repurchase Authorization By $1 Billion
SAN JOSE, Calif., May 16, 2016 -- Xilinx, Inc. (Nasdaq: XLNX) today announced that its Board of Directors has authorized the repurchase of up to an aggregate $1 billion of the Company's debt and equity securities. In the past five years, the Company has repurchased approximately 43 million shares of common stock for approximately $1.8 billion. Timing of repurchases and exact number of shares of common stock to be purchased will depend upon prevailing market conditions and other factors.
"Over the past 10 years, Xilinx has returned 100% of operating cash flow to stockholders through a combination of dividend and repurchase," said Moshe Gavrielov, Xilinx President and Chief Executive Officer. "Our repurchase authorization signals a high level of confidence in Xilinx's growth prospects as well as in our continued ability to consistently generate healthy operating cash flow."
About Xilinx
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs, and 3D ICs. Xilinx uniquely enables applications that are both software defined and hardware optimized – powering industry advancements in Cloud Computing, Embedded Vision, Industrial IoT, and 5G Wireless. For more information, visit www.xilinx.com.
|
Xilinx, Inc. Hot IP
Related News
- Synopsys Approves Stock Repurchase Program with Authorization Up to $1 Billion
- Xilinx Board of Directors Authorizes A Repurchase Of Up To $750 Million Of The Company's Outstanding Common Stock
- Synopsys Approves Stock Repurchase Program with Authorization Up to $1.5 Billion
- Synopsys Increases Stock Repurchase Authorization to $500 Million
- Saifun Board of Directors Authorizes the Repurchase of Up to 1.5 Million of Saifun Ordinary Shares
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |