IPhone Deal Would Boost Intel
Rumored LTE win would make Intel #3
Rick Merritt, EETimes
6/10/2016 01:50 PM EDT
SAN JOSE, Calif. – Intel Corp. could move into third place as a provider of smartphone modems if a growing number of reports are accurate it has won a substantial portion of sockets for LTE baseband chips in Apple’s iPhone 7. Such a deal would be a significant shot in the arm for Intel’s wireless business which took cuts in applications processors in the wake of a massive reorg announced in April.
Intel will provide more than 20 million LTE chips for iPhone 7 handsets for AT&T, according to a report from Bloomberg citing an unnamed source and Wall Street analysts. Such a deal could propel Intel into third place in smartphone modems next year from its 2015 position of a three-way tie for sixth place, according to Will Strauss, principal of market watcher Forward Concepts (Tempe, Ariz.).
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- InPsytech Joins Intel Foundry Accelerator IP Alliance to Boost HPC, AI, And Automotive Applications
- Valens Semiconductor Collaborates with Intel to Boost Automotive MIPI A-PHY Implementations
- eMemory Partners with Intel Foundry Services to Boost Security in Leading-Edge Chips
- Nvidia-Arm Deal Would Be a Technology "Disaster"
- Intel Promises to Boost 14nm Production
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation