IP Business Should Learn from EDA's Playbook
Dylan McGrath, Contributing Editor, EETimes
6/15/2016 04:25 PM EDT
Industry veteran sees parallels between IP's opportunity, EDA's rise.
Don’t try to tell Charlie Janac that the electronic design automation and semiconductor intellectual property businesses are branches of the same tree. Janac, who is more than 30 years into a career spanning both disciplines, believes that while the histories of EDA and IP are intertwined, they are not the same.
”I will maintain until my dying day that IP and EDA are very different,” Janac told EE Times in a recent interview. “There’s a huge difference between helping someone do a chip and actually being in the chip.”
But Janac, president and CEO of interconnect IP supplier Arteris Inc., does see parallels between the current state of the IP business and where EDA was 30 years ago. Back then, the vast majority of EDA tools were proprietary solutions created by the semiconductor companies that used them. And just as chip vendors eventually all but abandoned homegrown tools in favor of commercial offerings, Janac believes that they will ultimately cobble together SoCs from mostly commercial IP with a bit of “secret sauce” thrown in for differentiation.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Arteris Hot IP
Related News
- Ireland's Duolog flips to an EDA business model
- Secafy selects Siemens' EDA tools for innovative hardware security development
- Infineon further strengthens its number one position in automotive microcontrollers and boosts systems capabilities for software-defined vehicles with acquisition of Marvell's Automotive Ethernet business
- NanoXplore acquires Dolphin Design's ASIC business and strengthens its strategic position in aerospace
- China's EDA startup X-Epic forced to lay off staff, says report
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation