Automotive, medical, industrial, and peripheral applications benefit from reduced component count and cost.
Pocatello, Idaho - September 23, 2002 - AMI Semiconductor (AMIS) announces the availability of I3T80 - the first in a series of I3T mixed–signal technologies that allows system designers to reduce component count, save space and lower costs by integrating complex digital circuitry, embedded microprocessors and high-voltage functionality into a single IC. Suitable for automotive, medical, industrial, peripherals and other high-voltage designs, the AMIS I3T80 ASIC technology enables the delivery of the industry's first 0.35µ CMOS "Smart Power" system-on-chip (SoC) solutions for voltages up to 80V.
"I3T80 is the first high–voltage technology that integrates powerful 80V capabilities within a dense mixed–signal 0.35µ CMOS technology," said Marnix Tack, worldwide technology director at AMIS. "It allows our customers to develop complex high–voltage Smart Power SoC solutions for applications in areas such as the proposed 42-V PowerNet specification."
The AMIS I3T technology roadmap plans for the launch of I3T technologies for other voltage levels and a 50V version of the technology should be available by the end of 2002.
The I3T80 technology comes with a full library of high–voltage DMOS and bipolar devices including high performance floating vertical nDMOS transistors with very low on resistances (RDS (ON)) down to 150mΩ.mm2 and breakdown voltages higher than 80V. ESD performance of well above 4kV HBM has been proven. The technology is built upon the existing AMIS LV mixed–signal 0.35µ CMOS process with features such as high-density Metal-Metal capacitors and well-matched high ohmic resistors. A rich digital library offers a gate density of 15,000/mm2 and a wide portfolio of IP is available.
I3T80 can deliver Smart Power SoC devices with total gate counts in excess of 150k. These SoC devices can incorporate high-voltage circuitry such as motor controller drivers and DC-DC converters and high-precision analog circuits including bandgap filters, ADCs and DACs. Available IP blocks cover PLLs, USB interfaces, bus protocol controllers and controllers for CAN and LIN connectivity, while ROM and RAM memory solutions can all be supplied. A low-cost embedded One Time Programmable (OTP) memory is currently available and a high-density flash memory will be released in early 2003. Embedded microprocessor options include ARM7TDMI and 8051 cores.
About AMI Semiconductor
AMI Semiconductor (AMIS) is a world leader in the design and manufacture of application-specific integrated circuits (ASICs). As a widely recognized innovator in state-of-the-art mixed-signal technologies and mid-range digital ASICs including ASIC conversion services, AMIS is committed to providing customers with the lowest cost, quickest time-to-market ASIC solutions. Offering unparalleled manufacturing flexibility and dedication to customer service, AMI Semiconductor operates globally with headquarters in Pocatello, Idaho and a network of sales and design centers located in the key markets of the United States, Europe and the Asia Pacific region.