IBM, Samsung Put New Spin on MRAM
11-nm spin-torque readied
R. Colin Johnson, EETimes
7/7/2016 09:00 AM EDT
LAKE WALES. Fla—On the 20th anniversary of its invention at IBM Research, fabled nonvolatile "universal" magnetic random access memory (MRAM) is getting an upgrade. IBM announced today (July 7) that, in collaboration with foundry-giant Samsung, it is using a spin-transfer torque (STT) design on its MRAM.
Faster than flash and as dense as dynamic random access memory (DRAM), this universal memory genre is now being readied for manufacturing with a final round of material optimization and engineering finesse at IBM (Yorktown Heights, N.Y.). IBM says its STT MRAM access clocks at 10 nanoseconds and ultra-low-power (7.5 microamps), claiming its MRAM outperforms flash at the speed of DRAM. Applications include everything from tiny Internet of Things (IoT) system-on-chips (SoCs) to vast mass storage systems for servers.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
- IBM, Samsung Unveil VTFET to Extend Moore's Law
- Spin Memory Teams With Applied Materials to Produce a Comprehensive Embedded MRAM Solution
- Spin Memory's MRAM Design-Enhancing Endurance Engine Licensed by Arm
- Spin Transfer Technologies Announces Breakthrough MRAM Technology for SRAM and DRAM Applications
- Spin Transfer Technologies Announces Allowance of U.S. Patent For Next-Gen MRAM
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation