Ultra-low power 32 kHz RC oscillator designed in GlobalFoundries 22FDX
Barcelona Design Appoints Bob Johnson Executive Vice President of Worldwide Field Operations
Update: Barcelona has been bought by Synopsys
Newark, Calif., September 30, 2002 -- Barcelona Design Inc., the leading provider of synthesizable full-custom analog intellectual property (IP), today announced the appointment of Bob Johnson as executive vice president of worldwide field operations. Bob is responsible for growing Barcelona's global strategic activities related to sales, services and field operations.
"Bob's appointment brings high-level leadership and expertise to Barcelona's field operations that will accelerate the company's momentum in creating a new market for synthesizable analog IP," said Thomas Heydler, CEO of Barcelona Design. "Bob's proven track record and skill at driving revenue growth, winning large global contracts and improving sales efficiency will help Barcelona to take full advantage of our strong competitive position in analog IP. We are delighted to have Bob directing our global operations efforts."
Bob Johnson joined Barcelona from Tality – a Cadence Design Systems subsidiary – where he was the vice president of worldwide sales, responsible for building the sales organization, improving sales efficiency and increasing bookings. Bob successfully built Tality's sales team and increased top-line growth by more than 150 percent. On his prior assignments, Bob held several senior sales management positions at Cadence Design Systems, High Level Design Systems, and Hewlett Packard. He brings to the team more than sixteen years of experience in worldwide field operations and strategic account development in the EDA and IP industries.
About Barcelona Design, Inc.
Barcelona Design is the leading supplier of synthesizable full-custom analog IP, offering unique semiconductor intellectual property complemented by powerful design technology. Barcelona was founded in 1999 by CTO Dr. Mar Hershenson and Stanford University professor Dr. Stephen Boyd as a result of their research on the application of convex optimization mathematics to analog circuit design. The firm's analog circuit solution enables electronics companies to implement complex intellectual property (IP) instances radically faster than ever before. The company has proven its technology with working silicon, and has demonstrated market acceptance of its innovative approach by winning key customers, including Mitsubishi and ST Microelectronics. Barcelona has secured financing from leading venture capitalists including, Crosslink Capital, Sequoia Capital and Foundation Capital. The firm is headquartered in Newark, CA. For more information please visit www.barcelonadesign.com.
|
Related News
- Barcelona Design Appoints Ariel Sella as Executive Vice President of Marketing
- MIPS Technologies Appoints New Vice President of European Field Operations
- Breker Verification Systems Appoints Andy Stein Vice President of Worldwide Sales as Company Scales New Business Opportunities
- Flex Logix Appoints Chris Passier as Vice President, Platform Software and Vancouver, Canada Site Executive
- Mark Redford Named Vice President, Operations & Supply Chain for Palma Ceia SemiDesign - Former Arm Executive
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |