Intel Grabs ARM for 10nm Foundry
Best density claimed in 10nm node
Rick Merritt, EETimes
8/16/2016 05:45 PM EDT
SAN FRANCISCO – Intel revealed its 10nm process could outperform other foundries and will be used to make ARM-based mobile chips for companies including LG Electronics. To enable the move, Intel partnered with ARM’s Artisan division that is porting a reference design for one of its 64-bit cores to the process.
The news at the annual Intel Developer Forum here reinforced the x86 giant’s continued strength in process technology. It also highlighted its need for a still-fledging foundry business to participate fully in the mobile market.
Separately, China’s Spreadtum will make mobile chips in Intel’s current 14nm process. In addition, Intel’s 14nm Stratix 10 FPGAs will sample next quarter using a novel packaging technology that provides a lower cost than existing 2.5D techniques.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Intel Foundry and Arm Announce Multigeneration Collaboration on Leading-Edge SoC Design
- Intel Foundry embraces ARM; the start of the end?
- Intel Custom Foundry Certifies Cadence Implementation and Signoff Tools for 10nm Tri-Gate Process
- Intel Custom Foundry Certifies Mentor Graphics Physical Verification and Circuit Simulation Tools for 10nm Tri-Gate Process
- Intel Custom Foundry Certifies Synopsys Implementation and Signoff Tools for 10-nm Tri-Gate Process
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation