NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
3DSP and Pioneer collaborate on advanced DSP technology
IRVINE, Calif., October 2, 2002 - 3DSP Corporation, the leader in configurable digital signal processor (DSP) architectures, today announced that it has been collaborating with the research and development group at Pioneer Corporation to develop a highly integrated DSP solution for advanced digital video technology. They have collaborated to reduce overall system costs with several design studies. Preliminary results indicate that a significant reduction can be achieved with 3DSP's advanced DSP cores and software development tools.
"Matching Pioneer's innovative approach to next-generation products, we have enjoyed working with 3DSP for more than one year and coming to understand their high performance, flexible cores," said Toru Akiyama, General Manager of Broadcasting Systems Department Information & Communication Development Center, Research & Development Group at Pioneer Corporation. "We are very impressed with 3DSP's creative solutions and the company's knowledgeable engineering support team."
"The collaboration with Pioneer to implement 3DSP's IP into a silicon solution signifies a confirmation of the viability of our DSP architecture," said Kan Lu, CTO at 3DSP. "It has been a great working experience to join forces with the premier provider of Audio and Visual products."
About 3DSP
3DSP offers the industry's only fully configurable digital signal processing architecture with a comprehensive object-oriented design environment and application-based intellectual property. 3DSP's technology empowers system designers to create custom SoC solutions in silicon that achieve significant competitive advantages in terms of performance, integration, power consumption, cost and time-to-market for tomorrow's multimedia, wireless and Voice over Packet applications. For more information on the company and its products, visit www.3dsp.com or contact 3DSP headquarters at 16271 Laguna Canyon Rd., Irvine, CA 92618, phone: (949) 435-0600 fax: (949) 435-0700.
About Pioneer
Pioneer Corporation is one of the leading manufacturers of consumer- and business- use electronics products such as audio, video and car electronics on a global scale. Founded in 1938 in Tokyo, Pioneer Corporation employs more than 32,000 people worldwide. Its shares are traded on the New York Stock Exchange (Ticker symbol: PIO), Euronext Amsterdam, Tokyo Stock Exchange (Code: 6773), and Osaka Securities Exchange. The Pioneer Group is aiming to become an "Entertainment-Creating Company" following the spirit of the Group Philosophy of "Move the Heart and Touch the Soul."
3DSP Corporation and 3DSP are trademarks of 3DSP Corporation.
Other trademarks are the property of their respective owners.
|
Related News
- DSP Group and Inside Secure Collaborate on Development of Advanced Secured AI Processors
- Kudelski IoT and u-blox collaborate to bring advanced security to autonomous driving, drones and agricultural applications
- Ceva Unveils Latest High-Performance, High-Efficiency Communication DSPs for Advanced 5G and 6G Applications
- Infineon, POLYN to Collaborate on Advanced Tire Monitoring Products
- Synopsys and TSMC Collaborate to Accelerate 2nm Innovation for Advanced SoC Design with Certified Digital and Analog Design Flows
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |