LEDA Systems®'PCI Express I/O Library Targets UMC's 0.13-micron advanced CMOS process
Library enables SOC development of a new class of bandwidth-hungry applications such as DVD-quality streaming video, graphic-intensive video games for PCs, and 10G Ethernet NIC cards for servers.
San Jose, Calif., October. 3rd, 2002, - LEDA Systems® Inc., the leader in IP and Platforms for analog and mixed signal Systems-on-a-Chip (SoC), today announced that its PCI Express I/O for SOC designs targets UMC's 0.13 micron CMOS process. The company's analog and mixed-signal cores are also available on UMC's 0.25 to 0.13 micron processes.
"The need for speed continues and the advancement of PCI Express is a natural extension of our PCI architecture. By targeting our product line of high-speed I/Os to UMC's CMOS process, it can now be utilized by a broader range of customers," said Steve Kompolt, VP of Marketing of LEDA Systems. "Our experience with the 8b/10b encoding technique for achieving very high data rates can be applied directly to our PCI Express offering. We expect that the market demand for PCI Express will be very high."
"C. T. Lee, VP of Corporate Marketing at UMC, said, "UMC is committed to offering an extensive portfolio of IP cores to customers so they can choose the best cores for their specific design requirements. Leda's analog, mixed signal and PCI Express IP are welcome additions to our Gold IP Catalog."
The LEDA Systems' PCI Express utilizes LEDA's patented Direct Bump Access Technology (DBA™)which provides the lowest resistance and impedance for increased performance of the PCI Express I/O.
LEDA Systems is a leader in analog and mixed-signal IP, in terms of its design expertise, breadth and depth of product line, number of engineers and number of design wins. The company offers a broad range of proven IP, including SerDes, DAC/ADC, PLLs, high-speed bus interface I/O SPI-4 Phase 2 and other I/O components. LEDA's products are licensed directly to ASIC and COT design houses, and support all major foundries. LEDA's complete product line and foundry relationships provide SOC designers with one resource for all their analog and mixed-signal IP needs.
About LEDA Systems Inc.
LEDA Systems Inc., founded in 1995, is a leader in the field of mixed-signal and analog Intellectual Property design and development. LEDA provides a single comprehensive source for mixed-signal IP from special I/Os, DAC/ADC and PLLs, to high performance Serial Link Transceivers. LEDA Systems®. is a worldwide organization, headquartered in Plano, Texas, with a sales/marketing office in San Jose, Calif., and an engineering branch in Yerevan, Armenia. LEDA has licensed its technology to more than 50 customers including Agilent ® Technologies, Intel ® and LSI Logic ®, for the development, manufacture and sales of high performance ICs. For more information, visit the LEDA Systems Web site at www.ledasystems.com or call 408.275.1416.
|
Related News
- LEDA Systems® Introduces DBA (Direct Bump Access) FlipChip Ready I/O Library For 0.13 and 0.10-micron advanced CMOS processes
- NurLogic Further Expands Intellectual Property Offering With Standard Cell and I/O Libraries Utilizing TSMC's Advanced 0.13-Micron Process
- VeriSilicon and SMIC Jointly Announce Standard Design Platform for SMIC's Advanced 0.13-micron CMOS Process Technology
- NurLogic delivers Industry's first PCI-X 2.0 I/O 0.13-Micron Buffer
- Faraday Expands Free Library Offerings for UMC's 130nm (0.13-micron) Logic Process
Breaking News
- TSMC September 2024 Revenue Report
- Crypto Quantique teams up with Attopsemi to simplify the implementation of PUF technology in MCUs and SoCs
- Intel, TSMC to detail 2nm processes at IEDM
- SensiML Expands Platform Support to Include the RISC-V Architecture
- MIPI Alliance Announces OEM, Expanded Ecosystem Support for MIPI A-PHY Automotive SerDes Specification
Most Popular
- Deeptech Keysom completes a €4M fundraising and deploys the first “no-code” tool dedicated to the design of tailor-made processors
- Bluetooth® V6.0 Channel Sounding RF Transceiver IP Core in 22nm & 40nm for ultra-low power distance aware Bluetooth connected devices
- Secure-IC unveils its Securyzr™ neo Core Platform at Embedded World North America 2024
- LDRA Announces Extended Support for RISC-V High Assurance Software Quality Tool Suite to Accelerate On-Target Testing of Critical Embedded Applications
- Electronic System Design Industry Posts $4.7 Billion in Revenue in Q2 2024, ESD Alliance Reports
E-mail This Article | Printer-Friendly Page |