By Rick Merritt, EETimes,SAN JOSE, Calif., Sept. 20, 2016 – A teardown posted today confirmed Apple put Intel inside at least some of its iPhone 7 handsets, using the x86 giant's baseband processors acquired from Infineon. The report said Apple used TSMC to make at least some of its A10 Fusion SoCs, probably using its InFO packaging process as well.
Both Intel and TSMC were expected to win the sockets in the latest iPhones announced earlier this month. The teardowns confirm earlier reports of deals that represent millions of dollars of business to both companies, probably making Intel the third largest supplier of cellular baseband chips behind Qualcomm and Mediatek.