Scalable, On-Die Voltage Regulation for High Current Applications
Via Expands LTE Patent Pool License Coverage to Include LTE-Advanced
Increased Patent Coverage with No Change in Royalty Rate
SAN FRANCISCO -- September 28, 2016 -- Via Licensing Corporation today announced the expansion of its groundbreaking LTE (Long-Term Evolution) patent pool to include the LTE-Advanced standard technologies with no change in the program’s royalty rate. By enhancing its offering to include LTE-Advanced, Via is accelerating innovation by providing cost-effective, efficient and transparent access to more LTE standard essential patents.
LTE-Advanced is being deployed worldwide and features advanced capabilities that present a significant opportunity for the wireless ecosystem. By creating products and services that can deliver faster wireless connections as well as the ability to send mobile data more effectively by combining multiple channels, LTE-Advanced delivers new innovations and increased benefits to a rapidly growing market of LTE wireless products and services.
“Via’s LTE Program is committed to providing access to the latest technologies under the same royalty rate, terms and conditions,” said John Ehler, Senior Director of Wireless Programs, Via. “The latest enhancements to Via's LTE Patent Pool are designed to help manufacturers and service providers bring products to market in a more cost-effective and predictable manner.”
Companies offering their patents through Via’s LTE patent pool are AT&T, China Mobile, Clear Wireless, Deutsche Telekom, DTVG Licensing, Google, Hewlett-Packard, KDDI Corporation, Newracom, NTT DOCOMO, SK Telecom, Telecom Italia, Telefónica and ZTE Corporation. By making these essential patents available through a patent pool, Via’s licensing program significantly reduces the risk of litigation for those organizations that are building products or services based on the LTE standard.
Participation in Via’s LTE Patent Pool is open to all owners of essential LTE patents. Any party that believes it holds such a patent is encouraged to submit the patent to Via for evaluation by an independent patent evaluator. Parties manufacturing or selling LTE devices or components and other implementers of the LTE standard should visit www.via-corp.com/licensing/lte/index.html or contact Via at info@vialicensing.com to request an LTE Patent License Agreement or to obtain more information about the LTE program.
About Via Licensing Corporation
Via is a recognized leader in the development and administration of licensing programs for mandated, de facto and emerging standards on behalf of innovative technology companies around the world. Via Licensing Corporation is a wholly owned subsidiary of Dolby Laboratories, Inc., a company with more than 50 years of experience in technology licensing. For more information about Via, please visit http://www.via-corp.com.
|
Related News
- InterDigital and Sharp Corporation Expand Patent License Agreement to Include LTE Coverage
- Via LA Announces Extension of HEVC Patent Pool to Include VVC and Welcomes TCL Into Newly Formed Program
- MPEG LA Expands AVC License to Include Complete MVC Coverage
- Google Joins Via Licensing's LTE Patent Pool
- InterDigital and Quanta Computer Expand Patent License Coverage to Include 4G
Breaking News
- UPMEM selects Semidynamics RISC-V AI IP for Large Language Model Application
- Sondrel now shipping chips as part of a complete turnkey project
- Avant Technology Appointed as Sales Representative in Asia for EnSilica's eSi-Crypto IP
- CXL Consortium Announces Compute Express Link 3.2 Specification Release
- Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2024
Most Popular
- Now Gelsinger is gone, what is Intel's Plan B?
- Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2024
- Qualitas Semiconductor's MIPI D-PHY IP Powers Mass Production of Renesas AI MPU
- Marvell Unveils Industry's First 3nm 1.6 Tbps PAM4 Interconnect Platform to Scale Accelerated Infrastructure
- Alphawave IP - Announcement regarding leadership transition
E-mail This Article | Printer-Friendly Page |