Open-Silicon to showcase ARM Cortex-M based IoT Custom SoC Platform at ARM TechCon
October 3rd, 2016
WHAT: Open-Silicon, a system optimized ASIC solutions provider, will be exhibiting at ARM® TechCon™ 2016 Santa Calara, on Oct. 25 – 27, 2016, and will demonstrate the company’s ARM® Cortex®-M based IoT Custom SoC Platform. Visit our booth on the Expo floor for the demo and also to learn about Open-Silicon’s other innovative ASIC solutions including HBM2 IP Subsystem Solution.
- ARM® Cortex®-M based IoT Custom SoC Platform – Demonstrates end-to-end communication between sensor hubs and a cloud platform through a gateway device. Depending upon the type of radio technology, the sensor hubs can be used outdoors, on the factory floor or inside a room. This Industrial IoT system setup is part of Open-Silicon’s Spec2Chip IoT Platform, which allows IoT ASIC designs to be evaluated at the system level.
- HBM2 IP Subsystem Solution – This solution is now available for 2.5D ASIC design starts and also as licensable Intellectual Property (IP). Open-Silicon’s IP fully complies with the HBM2 JEDEC® standard. The IP translates user requests into HBM command sequences (ACT, Pre-Charge) and handles memory refresh, bank/page management and power management on the interface. The IP includes the PHY and custom die-to-die I/O needed to drive the interface between the logic-die and the memory die-stack on the 2.5D silicon interposer.
WHEN: Wednesday, October 26, 2016 from 10:30am – 6:30pm, and
Thursday, October 27, 2016 from 10:30am – 6:30pm
WHERE: Booth No. 935 on Exhibition Floor at Santa Clara Convention Center, CA.
WHY: ARM® TechCon™ 2015 delivers an at-the-forefront comprehensive forum created to ignite the development and optimization of future ARM-based embedded products. By offering three full days of technical tracks, demonstrations, and industry insight from broad and deep levels of industry-leading companies and innovative start-ups, ARM TechCon remains more than a tradeshow; it is a comprehensive learning environment for the entire embedded community, uniting the software and hardware communities.
With combined activities for chip designers, system implementation engineers and software developers in a shared space, attendees will learn from each other and collaborate on innovations, while also benefiting from dedicated activities to address the specific needs of their unique communities.
About Open-Silicon: Open-Silicon transforms ideas into system-optimized ASIC solutions within the time-to-market parameters desired by customers. The company enhances the value of customers’ products by innovating at every stage of design – architecture, logic, physical, system, software and IP – and then continues to partner to deliver fully tested silicon and platforms. Open-Silicon applies an open business model that enables the company to uniquely choose best-in-industry IP, design methodologies, tools, software, packaging, manufacturing and test capabilities. The company has partnered with over 150 companies ranging from large semiconductor and systems manufacturers to high-profile start-ups, and has successfully completed 300+ designs and shipped over 120 million ASICs to date. Privately-held, Open-Silicon employs over 250 people in Silicon Valley and around the world. www.open-silicon.com
|
Related News
- Open-Silicon Offers IoT Custom SoC System Based on ARM Cortex-M Processors
- Open-Silicon to Demonstrate its High Bandwidth Memory (HBM2) IP Subsystem Solution for High Performance Computing and Networking Applications and Showcase its IoT Gateway SoC Reference Design for Smart City Applications at ARM TechCon 2017
- Open-Silicon to Showcase its Spec2Chip IoT SoC Platform Solution Consisting of IoT Edge SoC Platform and IoT Gateway SoC Platform at IoT DevCon Santa Clara on April 26-27, 2017
- Open-Silicon to Demonstrate and Present on Custom SoC Platform Solutions for AI Applications at the TSMC OIP Event in Santa Clara
- Open-Silicon Announces IoT Gateway SoC Platform
Breaking News
- Silicon industry veteran Oreste Donzella joins Sondrel board as Non-Executive Director
- Powering the NVM and Embedded Chip Security Technologies
- BOS and Tenstorrent Unveil Eagle-N, Industry's First Automotive AI Accelerator Chiplet SoC
- BBright Expands Ultra HD Capabilities with intoPIX JPEG XS Technology in its V2.2 Decoder Platform
- Jmem Tek and Andes Technology Partner on the World' s First Quantum-Secure RISC-V Chip
Most Popular
- MosChip selects Cadence tools for the design of HPC Processor “AUM” for C-DAC
- Cadence and Rapidus Collaborate on Leading-Edge 2nm Semiconductor Solutions for AI and HPC Applications
- Quobly announces key milestone for fault-tolerant quantum computing
- Synopsys Announces Industry's First Ultra Ethernet and UALink IP Solutions to Connect Massive AI Accelerator Clusters
- Alphawave IP - Announcement regarding leadership transition
E-mail This Article | Printer-Friendly Page |