NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
Kilopass Reveals New VLT DRAM Technology This Week at MemCon, CSIA-ICCAD
Update: Synopsys Expands DesignWare IP Portfolio with Acquisition of Kilopass Technology (Jan. 10, 2018)
MemCon Presentation Details VLT’s DRAM Application
SAN JOSE, CALIF. –– October 11, 2016 –– Kilopass Technology, Inc., the leading provider of semiconductor embedded non-volatile memory (eNVM) intellectual property (IP), will highlight its new Vertical Layered Thyristor (VLT) DRAM technology this week at MemCon and CSIA-ICCAD 2016 Annual Conference & Changsha IC Industry Innovation and Development Summit.
MemCon will be held today at the Santa Clara Convention Center in Santa Clara, Calif., and Kilopass will be in Booth #100. Kilopass will exhibit in Booth #119 during CSIA-ICCAD in Changsha, China, October 12-13 at The Hunan International Conference & Exhibition Center in Changsha, China.
VLT, introduced October 10, eliminates the need for DRAM refresh, is compatible with existing process technologies and offers significant other benefits including lower power, better area efficiency and compatibility. The VLT bitcell was validated in 2015, and a full memory macro test chip is in early stages of testing. (See news release titled, “Kilopass Delivers ‘Refresh’ on DRAM Technology.”)
Kilopass’ Engineering Fellow Bruce Bateman will present “A Novel Bulk Vertical-Layer Thyristor Cell for DRAM Applications” during MemCon from 4:50 p.m. until 5:35 p.m. as part of the Enabling Technologies Track.
Information about MemCon can be found at: www.memcon.com
The website for CSIA-ICCAD 2016 is: http://bit.ly/2dqGR84
To learn more about Kilopass, go to: www.kilopass.com
About Kilopass
Kilopass Technology, Inc., is the leader in embedded non-volatile memory (NVM) intellectual property (IP). Its patented technologies of one-time programmable (OTP) NVM solutions have boundless capacity to scale to advanced CMOS process geometries. They are portable to every major foundry and integrated device manufacturer (IDM), and meet market demands for increased integration, higher densities, lower cost, low-power management, better reliability and improved security. Trusted by today's best-known brands, Kilopass' technology has been integrated by more than 170 customers, with 10-billion units shipped in over 400 industrial, automotive, consumer electronics, mobile, analog and mixed-signal, and internet of things (IoT) chip designs. For more information, visit www.kilopass.com or email info@kilopass.com
|
Related News
- Kilopass to Demonstrate Ultra Low-Power, High-Performance Non-Volatile Memory IP at CSIA-ICCAD 2014 in Hong Kong
- Kilopass Delivers 'Refresh' on DRAM Technology
- Kilopass Spans the Globe Next Week to Participate at GSA European Executive Forum, Internet of Things Developers Conference in the U.S., TSMC Technical Symposium in China
- Uniquify to Present High-Performance DDR3 Memory System in Low-Cost Wire Bond Package, Fastest DDR4 Memory IP at CSIA-ICCAD 2014 in Hong Kong
- DDR PHY Interface Specification to be Unveiled Next Week at MemCon
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |