Xilinx Announces Production Milestone for 16nm UltraScale+ Portfolio Ahead of Schedule
Company opens order entry for production devices this quarter
SAN JOSE, Calif. -- Oct. 12, 2016 -- Xilinx, Inc. (NASDAQ:XLNX) today announced it has reached a significant production milestone for its 16nm UltraScale+™ portfolio ahead of schedule. Less than a year after first ship of all devices, open order entry for production devices is available this quarter. The Xilinx® UltraScale+ portfolio is the only FinFET-based programmable technology available at 14nm or 16nm in the industry. The portfolio includes Kintex®, Virtex® UltraScale+ FPGAs and Zynq® UltraScale+ MPSoCs.
"This production milestone further stretches our greater than one year lead in 16nm product delivery," said Moshe Gavrielov, president & CEO at Xilinx. "I'm proud of Xilinx's three consecutive generations of development and operational excellence."
About Xilinx
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs, and 3D ICs. Xilinx uniquely enables applications that are both software defined and hardware optimized – powering industry advancements in Cloud Computing, Embedded Vision, Industrial IoT, and 5G Wireless. For more information, visit www.xilinx.com.
|
Xilinx, Inc. Hot IP
Related News
- Xilinx Advances State-of-the-Art in Integrated and Adaptable Solutions for Aerospace and Defense with Introduction of 16nm Defense-Grade UltraScale+ Portfolio
- Xilinx Announces Vivado Design Suite Early Access Support for the 16nm UltraScale+ Portfolio
- Xilinx Expands into New Applications with Cost-Optimized UltraScale+ Portfolio for Ultra-Compact, High-Performance Edge Compute
- Xilinx Extends its Breakthrough Zynq UltraScale+ RFSoC Portfolio to Full sub-6GHz Spectrum Support
- Enyx Premieres 25G TCP and UDP Offload Engines with Xilinx Virtex UltraScale+ 16nm FPGA on BittWare's XUPP3R PCIe Board
Breaking News
- Alphawave Semi announced today a refocussing of the Board of Directors after reaching the three-year milestone since the Company's IPO
- Synopsys and Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU with Leading Performance on Samsung Foundry's GAA Process
- Worldwide Silicon Wafer Shipments Dip 5% in Q1 2024, SEMI Reports
- GOWIN's progress in global automotive market gathers momentum with award of ISO 26262 certification for its FPGA design environment
- PCI-SIG® Announces CopprLink™ Cable Specifications for PCIe® 5.0 and 6.0 Technology
Most Popular
- Silvaco Announces Launch of Initial Public Offering
- TSMC's A16 Process Moves Goalposts in Tech-Leadership Game
- Radiation-Tolerant PolarFire® SoC FPGAs Offer Low Power, Zero Configuration Upsets, RISC-V Architecture for Space Applications
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- QuickLogic Releases Aurora 2.6 with Expanded Operating System Support and Up to 15% Faster Performance
E-mail This Article | Printer-Friendly Page |