Faraday Unveils Uranus SoC Development Platform for Ultra-Low-Power IoT
HSINCHU, Taiwan, October 19, 2016 -- Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today introduced the Uranus™ 55nm ultra-low-power SoC development platform for IoT applications. As the latest member of its MCU-based SoC development platform series, Uranus features Faraday’s PowerSlash™ IP, USB 2.0 interface, 12-bit 8-channel ADC, 10-bit DAC, embedded flash memory, and comprehensive SDK support, demonstrating the next level of IoT chip power-saving.
Faraday’s SoC development platform effectively reduces the time-to-market of system products by allowing early software design ahead of chip availability. It offers an integrated environment consisting of mainstream processor core, pre-verified Faraday interface and fabric IP, along with SDK, upon which system software may be built. Further on the premises, Uranus™ platform demonstrates DVFS power modes management to balance trade-offs between performance and power consumption. In particular, its Turbo Mode alters the trade-off point to enable MCU core achieve 2x performance under given power constraint.
“As the driver of ASIC design service innovations, Faraday’s SoC development platform series aims not only to help customer’s chip design but also its system development,” said Steve Wang, President of Faraday. “Satisfying both ultra-low-power and high-performance needs has become the key for next-generation IoT chip design. We proudly present Uranus™, the newest member of our platform series, to provide the right tool for achieving that goal.”
For Uranus™ (FIE3255) demonstration, please visit Faraday at the following exhibitions:
- SEDEX, Oct 26-28 in Seoul, Korea
- ARM Tech Symposia, Oct 31 in Shanghai, China
- Embedded Technology, Nov 16-18 in Yokohama, Japan
About UMC
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced IC production for applications spanning every major sector of the electronics industry. UMC’s robust foundry solutions enable chip designers to leverage the company’s sophisticated technology and manufacturing, which include 28nm gate-last High-K/Metal Gate technology, ultra-low power platform processes specifically engineered for Internet of Things (IoT) applications and the highest-rated AEC-Q11 Grade-0 automotive industry manufacturing capabilities. UMC’s 10 wafer fabs are located throughout Asia and are able to produce over 500,000 wafers per month. The company employs over 17,000 people worldwide, with offices in Taiwan, mainland China, Europe, Japan, Korea, Singapore, and the United States. UMC can be found on the web at www.umc.com
About Faraday Technology Corporation
Faraday Technology Corporation is a leading fabless ASIC and silicon IP provider. The broad silicon IP portfolio includes I/O, Cell Library, Memory Compiler, ARM-compliant CPUs, DDR2/3/4, low-power DDR1/2/3, MIPI, V-by-One, MPEG4, H.264, USB 2.0/3.1 Gen 1, 10/100/1000 Ethernet, Serial ATA, PCI Express, and programmable SerDes, etc. Headquartered in Taiwan, Faraday has service and support offices around the world, including the U.S., Japan, Europe, and China. Faraday is listed on the Taiwan Stock Exchange, ticker 3035. For more information, please visit www.faraday-tech.com
|
Faraday Technology Corp. Hot IP
Related News
- Faraday Unveils New IoT SoC Platform to Accelerate Early-Stage ASIC Development
- Faraday Launches Ariel SoC Platform with Infineon's SONOS eFlash to Drive IoT Development
- Faraday Unveils RISC-V ASIC Solution to Support Edge AI and IoT SoCs
- Faraday's PowerSlash IP Now Available on UMC's 55nm Ultra-Low-Power IoT Platform
- Faraday Launches Cortex-A53-based Platform to Accelerate FinFET SoC Development
Breaking News
- MIPI Alliance Announces OEM, Expanded Ecosystem Support for MIPI A-PHY Automotive SerDes Specification
- Deeptech Keysom completes a €4M fundraising and deploys the first "no-code" tool dedicated to the design of tailor-made processors
- LDRA Announces Extended Support for RISC-V High Assurance Software Quality Tool Suite to Accelerate On-Target Testing of Critical Embedded Applications
- Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production
- Secure-IC unveils its Securyzr™ neo Core Platform at Embedded World North America 2024
Most Popular
- Deeptech Keysom completes a €4M fundraising and deploys the first “no-code” tool dedicated to the design of tailor-made processors
- Bluetooth® V6.0 Channel Sounding RF Transceiver IP Core in 22nm & 40nm for ultra-low power distance aware Bluetooth connected devices
- Secure-IC unveils its Securyzr™ neo Core Platform at Embedded World North America 2024
- LDRA Announces Extended Support for RISC-V High Assurance Software Quality Tool Suite to Accelerate On-Target Testing of Critical Embedded Applications
- Electronic System Design Industry Posts $4.7 Billion in Revenue in Q2 2024, ESD Alliance Reports
E-mail This Article | Printer-Friendly Page |