MegaChips Adopts Omni Design's Ultra-Low Power Analog-to-Digital Converter Front-Ends for Next-Generation Communication Networks
New Chips Support Higher Bandwidth Communications Needs for Faster Access and Home Networks
AN JOSE, Calif., Nov. 16, 2016 -- MegaChips Corporation, a global semiconductor company specializing in ASICs and Application Specific Standard products (ASSPs), and Omni Design Technologies, a provider of high-performance, ultra-low power semiconductor IP cores, today announced a strategic partnership for the development of high-performance, low-power analog front end (AFE) chips. This partnership brings together two industry leaders with the joint purpose of offering differentiated solutions and products to enable next-generation home and access networks and industrial automation.
"Both MegaChips and Omni Design offer unique technology for the communications market," said Masahiro Konishi, general manager at MegaChips Corporation. "By partnering with Omni Design Technologies, an industry leader in semiconductor IP cores, we can continue to develop timely, original AFE chips designed to give our customers a competitive edge."
Dr. Kush Gulati, president and CEO of Omni Design Technologies, said "MegaChips has an outstanding reputation for providing cutting-edge system solutions for its customers. We are delighted to partner with them to develop high-performance, ultra-low power AFEs incorporating high-resolution and high-speed Analog-to-Digital Converters (ADCs) based on our revolutionary SWIFT™ technology."
About Omni Design Technologies
Omni Design Technologies (http://www.omnidesigntech.com) is a developer of high-performance, ultra-low power semiconductor embedded IP cores that enable highly differentiated systems-on-chip (SoCs) in applications ranging from wired and wireless communications, connected sensors, and the internet-of-things (IoT). Omni's mission is to provide a wide range of disruptive ultra-low power, high-performance embedded circuits that enable highly differentiated semiconductor systems and plug-and-play SoC development. Omni is staffed by semiconductor industry veterans, world-class technologists from MIT, and experienced entrepreneurs.
About MegaChips Technology America Corporation ("MegaChips America")
MegaChips America is a wholly owned subsidiary of MegaChips Corporation headquartered in Osaka, Japan. As one of the premier semiconductor companies, MegaChips provides Integrated Circuits (ICs) and Systems on Chip (SoCs) that are essential for the advancement of Application Specific Standard Products (ASSPs). Leveraging decades of technology excellence, partnerships and acquisitions, MegaChips is exploring and shaping the next wave of the digital revolution, adding significant value for businesses and consumers in the global market with innovations in the areas of Internet of Things, Displays, Mobility, and Wearable devices. The company uses its advanced technological capabilities and know-how to help people achieve healthier, safer and more fulfilling lives. For more information, contact the company at 408-570-0555, or visit http://www.megachips.com.
|
Related News
- Alereon Adopts Omni Design's Low Power Analog-to-Digital and Digital-to-Analog Converters for Ultra-Wideband Applications
- Alvand Technologies' Ultra-Low Power ADC/DAC IP Has Been Selected By Faraday Technology for High-Performance, and Next-Generation Mixed-Signal ASICs
- Siroyan to Deploy Sequence's Power Theater Tools to Optimize OneDSP Cores for "Next-generation" Ultra-Low Power Designs
- Preferred Networks Inc. adopts Siemens' PowerPro software for next-generation AI chip design
- MegaChips Joins Imec and Holst Centre's research and development program on Ultra-low Power Radio
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |