Ultra-low power 32 kHz RC oscillator designed in GlobalFoundries 22FDX
Philippe Morali, High Technology Veteran, Joins eSilicon as CFO
Brings extensive international experience in finance and corporate development to the company
SAN JOSE, Calif. — November 22, 2016 — eSilicon Corporation, a leading independent semiconductor design and manufacturing solutions provider, today announced that Philippe Morali has been appointed as the new CFO, reporting to CEO Jack Harding.
“Philippe brings diverse experience from strong technology companies that are focused on a variety of markets,” said Mr. Harding. “eSilicon’s global footprint is growing in new markets and new regions, and I am confident that Philippe’s leadership will facilitate and enhance that growth.”
Mr. Morali brings more than 25 years of experience in financial leadership to eSilicon. He has had extensive international operational experience in Europe and Asia. Prior to eSilicon, he served as CFO for Quantenna Communications, Inc., a leading developer of next generation Wi-Fi semiconductor solutions. Prior to that, he served as vice president finance & corporate treasurer at Micron Technology, Inc. Mr. Morali has also held leadership positions at SanDisk Corporation; Palm, Inc.; and 3Com Corporation. He started his career at Hewlett-Packard. He received an MBA in Finance/International Business from the Columbia University Graduate School of Business and a License ès Sciences Commerciales et Industrielles degree from the University of Geneva, Switzerland.
“eSilicon’s collaborative approach to semiconductor design and manufacturing creates a compelling value proposition,” said Mr. Morali. “I see new market opportunities for the company, as well as continued growth in its existing Tier 1 customer base. I’m excited to join eSilicon during this time of expansion.”
About eSilicon
eSilicon guides customers through a fast, accurate, transparent, low-risk ASIC journey, from concept to volume production. Explore your options online with eSilicon STAR tools, engage with eSilicon experts, and take advantage of eSilicon semiconductor design, custom IP and IC manufacturing solutions through a flexible engagement model. eSilicon serves a wide variety of markets including the automotive, communications, computer, consumer, industrial products and medical segments. Get the data, decision-making power and technology you need for first-time-right results. www.esilicon.com
|
Related News
- Leading Industry Veteran Joins SiFive as Chief Financial Officer
- Silicon industry veteran Oreste Donzella joins Sondrel board as Non-Executive Director
- Industry veteran Volker Politz joins Semidynamics as Chief Sales Officer
- Chiplet Pioneer Eliyan Joins UCIe and JEDEC Industry Standardization Organizations, Expands Veteran Leadership Team to Accelerate Adoption of Breakthrough Die-to-Die Interconnect Solution
- Chris Stevens, Industry Veteran Joins BrainChip to Lead WW Sales
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |