NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
Texas Instruments Licenses Next-Generation ARM11 Cores for Future OMAP Processors and Wireless Chipsets
Combined ARM, TI technologies will provide higher performance and greater power efficiency for 2.5 and 3G devices
DALLAS, TX AND CAMBRIDGE, UK - Oct. 15, 2002– Texas Instruments Incorporated (NYSE:TXN) (TI) and ARM [(LSE:ARM); (Nasdaq:ARMHY)], the industry's leading provider of 16/32-bit embedded RISC microprocessor solutions, today announced that TI has licensed two new ARM11™ microprocessor cores which TI will use to develop future generations of wireless voice and multimedia solutions. When combined with TI's wireless systems expertise and digital signal processor (DSP) technology, the ARM1136J-S™ core and the ARM1136JF-S™ core, announced by ARM yesterday at the Microprocessor Forum, San Jose, Calif., will enable TI to provide equipment manufacturers with solutions that will increase system performance and extend battery life for 2.5 and 3G wireless handsets and PDAs. (See separate press release…ARM Sets Performance Standard with Two New ARM11 Cores…Oct. 14, 2002).
"ARM is committed to developing high-performance solutions to meet our Partners' requirements and target applications," said Mike Inglis, executive vice president, Marketing, ARM. "The combination of the new high-performance ARM11 cores, and TI's leading system-level expertise and DSP technology, will exceed the performance and power requirements of system developers for next-generation wireless and multimedia solutions."
The new ARM® solutions are the first microprocessor core implementations of the ARM11 microarchitecture, which is based on the ARMv6 instruction set developed in collaboration by TI and ARM. The ARM11 microarchitecture features a high-performance pipeline and high-bandwidth level-one memory system, which results in an extremely compact and power-efficient microprocessor core. These new features, which will be code-compatible with TI's current ARM core-based solutions, coupled with TI's wireless experience and DSP engines, will offer the increased performance and low power consumption required to run real-time audio and video applications.
"The new ARM11 cores will be an essential part of TI's wireless technology roadmap," said Alain Mutricy, vice president and OMAP Platform General Manager, TI. "Today, TI's wireless platforms, based on TI's DSP and ARM microprocessor cores, have been the standard for delivering the best technology, power efficiency and performance required to drive today's wireless handsets. By utilizing ARM11 solutions along with our advanced wireless DSP expertise, we will extend this standard through the next generation of high-end wireless handsets and PDAs."
TI and ARM have a long history of collaboration in the wireless space, including the licensing of cores from the ARM7™, ARM9™ and ARM10™ microprocessor families.
# # #
Texas Instruments Incorporated provides innovative DSP and analog technologies to meet our customers' real world signal processing requirements. In addition to Semiconductor, the company's businesses include Sensors & Controls, and Educational & Productivity Solutions. TI is headquartered in Dallas, Texas, and has manufacturing, design or sales operations in more than 25 countries.
Texas Instruments is traded on the New York Stock Exchange under the symbol TXN. More information is located on the World Wide Web site at www.ti.com.
ARM is a registered trademark of ARM Limited. ARM7, ARM9, ARM10, ARM11, ARM1136J-S and ARM1136JF-S, are trademarks of ARM Limited. All other brands or product names are the property of their respective holders. "ARM" is used to represent ARM Holdings plc (LSE: ARM and Nasdaq: ARMHY); its operating company ARM Limited; and the regional subsidiaries ARM INC.; ARM KK; ARM Korea Ltd.; ARM Taiwan; ARM France SAS; and ARM China.
TRADEMARKS
All trademarks and registered trademarks are the property of their respective owners.
|
Arm Ltd Hot IP
Related News
- SafeNet Security IP Helps Secure Texas Instruments Next-Generation OMAP Applications Processors
- MIPS Technologies Licenses Next-Generation 32-Bit Core to Texas Instruments for Use in Broadband Solutions
- AiM Future Introduces Next-Generation NeuroMosAIc Processors, Expands Partnerships
- Samsung licenses Apical's Assertive Display for next-generation Exynos processors
- Hisilicon Licenses Range of ARM Mali Graphics Processors to Drive the Next-Generation of Smart Connected Devices
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |