Samsung Reportedly Mulls Foundry Spinoff
EE Times
12/14/2016 06:01 PM EST
SAN FRANCISCO—South Korea’s Samsung Electronics Co. Ltd. is considering spinning out its foundry after losing Apple Inc.’s processor business to Taiwan Semiconductor Manufacturing Co. Ltd., according to a report by BusinessKorea, a Korean business news magazine.
Also under consideration is a reorganization that would combine the company’s SoC and LSI segments under one fabless semiconductor division.
Samsung is the fourth largest foundry supplier in the world, with a marketshare of roughly 5%, trailing only dedicated foundries Taiwan Semiconductor Manufacturing Co. (TSMC), Globalfoundries Inc. and United Microelectronics Corp. (UMC). Samsung’s foundry business is the largest of any integrated device manufacturer.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Samsung Spinoff Likely to Grab Foundry Share
- Apple, Samsung Reportedly Ink 14-nm Foundry Deal
- HCLTech joins Samsung Advanced Foundry Ecosystem as a Design Solution Partner
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
- Siemens' Solido SPICE now certified for multiple leading-edge Samsung Foundry processes
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation