Silicon-proven HBM Gen2 Hardened PHY from eSilicon
14LPP and 28HPC high-bandwidth memory PHY now available
SAN JOSE, Calif. — December 15, 2016 — eSilicon Corporation, a leading independent semiconductor design and manufacturing solutions provider, today announced the availability of its silicon-proven 14nm FinFET and 28nm planar HBM Gen2 Hardened PHY solution.
High-bandwidth memory (HBM), integrated with 2.5D technology, achieves higher bandwidth while using less power in a substantially smaller form factor than DDR4, GDDR5 or hybrid memory cube (HMC).
eSilicon’s HBM Gen2 PHY has been developed to JEDEC JESD235B specification on Samsung 14LPP and TSMC 28HPC technologies. It supports up to 256Gbytes/sec bandwidth with 8x128b channels at 2Gbps per I/O. The integrated I/O supports up to 2Gbps DDR operation across a 4mm interposer channel.
The HBM PHY is DFI 4.0 compliant with several controller-independent features such as:
- READ/WRITE/CK strobe training
- READ leveling training
- I/O calibration
- Lane repair
- Independent programmable control/status registers (CSRs) via APB or IEEE1500 interface
- MISR test
- The PHY may be integrated with any controller
“We are delighted with our complete 2.5D HBM solution,” said Lisa Minwell, eSilicon’s senior director, IP marketing. “eSilicon is delivering a low-risk solution with comprehensive silicon PPA characterization, reliability and test. Our interposer design with full electrical, thermal and mechanical analysis further reduces risk.”
eSilicon has been researching and developing products and processes that deliver a complete 2.5D HBM solution since 2011. eSilicon’s end-to-end HBM solution includes 2.5D ecosystem management, the PHY, ASIC design, SiP design, manufacturing, assembly and test.
Please contact eSilicon at ipbu@esilicon.com for more information, silicon quality results, white papers or data sheets. Or you can download the HBM Gen2 PHY brief.
About eSilicon
eSilicon guides customers through a fast, accurate, transparent, low-risk ASIC journey, from concept to volume production. Explore your options online with eSilicon STAR tools, engage with eSilicon experts, and take advantage of eSilicon semiconductor design, custom IP and IC manufacturing solutions through a flexible engagement model. eSilicon serves a wide variety of markets including the automotive, communications, computer, consumer, industrial products and medical segments. Get the data, decision-making power and technology you need for first-time-right results. www.esilicon.com
|
Related News
- Broadcom Announces Industry's First Silicon-Proven 7nm IP for ASICs in Deep Learning and Networking Applications
- Unleash Next-Gen Speeds with Silicon-Proven USB 3.0 PHY IP Cores with Type-C Support in Multiple Process Nodes
- T2M is excited to announce the successful licensing of our partner's Silicon-Proven 1G Ethernet PHY IP Cores on a Tier-1 Foundry in Korea, using the advanced 14LPP process, in collaboration with a leading Tier-1 Korean customer
- Inomize Selects Synopsys' Silicon-Proven 56G Ethernet PHY IP for High-Performance Computing and Communications SoC Design
- Synopsys Delivers Silicon-Proven HBM2E PHY IP Operating at 3.2 Gbps
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
Most Popular
- Qualitas Semiconductor and Ambarella Sign Licensing Agreement
- ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Intel and Arm Team Up to Power Startups
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024
E-mail This Article | Printer-Friendly Page |