China Dominates Planned Chip Fabs
Dylan McGrath, EETimes
12/15/2016 12:40 PM EST
SAN FRANCISCO—More than 40% of front end semiconductor fabs scheduled to begin operation between 2017 and 2020 are in China, a clear indication that China’s long-stated ambition to build a significant domestic semiconductor industry is taking shape.
According to SEMI, a trade group that represents semiconductor equipment and materials suppliers, of 62 front end fabs that will open worldwide over the next three years, 26 are in China, representing 42% of the global total.
Of the 62 fabs currently on the drawing board or in construction, most are volume manufacturing fabs, with seven slated to be R&D or pilot fabs, according to Christian Dieseldorff, director of semiconductor industry research at SEMI (San Jose, Calif.).
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation