NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
Wi-Fi Expands with .11ax at CES
Kevin Krewell, Principal Analyst, Tirias Research
EETimes (1/2/2017 02:20 PM EST)
As we approach the yearly post-New Year's Eve torture that is CES, one piece of good news is Wi-Fi is about to get better.
A new revision of the standard focused on supporting greater client density should begin to roll out in 2017 – 802.11ax. At CES 2017, we expect to hear about silicon support for 802.11ax and maybe see a few access points supporting it.
Current state-of-the-art wireless routers are based on the 802.11ac Wave-2 standard with multi user (MU) MIMO and 4x4 antenna arrays. They enable spatial reuse to minimize channel sharing among multiple simultaneous users. The marketing for these systems is typically based on their peak data rates to clients, but their most important benefit is increased capacity and improved user experience in crowded networks.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Imagination announces next-generation IEEE 802.11ax/Wi-Fi 6 IP for low-power applications
- Palma Ceia SemiDesign Tapes Out 802.11ax Transceiver for Wi-Fi 6
- AIC Semiconductor Licenses CEVA's 802.11ax Wi-Fi 6 IP for IoT Connectivity
- CEVA Announces Industry's First 802.11ax Wi-Fi IPs
- Qualcomm Announces First End-to-End 802.11ax Wi-Fi Portfolio
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation