Immortalis-G715, GPU providing ultimate mobile gaming experiences
UMC to port MoSys' one-transistor SRAM cell to advanced logic processes
![]() |
UMC to port MoSys' one-transistor SRAM cell to advanced logic processes
By Semiconductor Business News
September 24, 2001 (12:01 p.m. EST)
URL: http://www.eetimes.com/story/OEG20010924S0069
HSINCHU, Taiwan--Silicon foundry supplier United Microelectronics Corp. here and memory developer MoSys Inc. of Sunnyvale, Calif., today announced an extension to their cooperation in one-transistor SRAM technology for 0.15- and 0.13-micron logic-IC processes. UMC said it will port MoSys' 1T-SRAM cell to next-generation logic processes after previously verifying the memory technology on its 0.18-micron processes. The one-transistor SRAM cell is expected to be used in system-on-chip designs, which are primarily made up of logic blocks. The 1T-SRAM cell will double the bit density of embedded memory blocks compared to traditional SRAM designs, according to UMC and MoSys. "The combination of UMC's advanced logic processes and MoSys' 1T-SRAM technology provides designers with a strong technology platform for their next generation of SoC products," stated Jean Tien, strategic marketing vice president of UMC.
Related News
- MoSys to port 1T-SRAM-Q technology to UMC's 0.13-micron and 90-nanometer processes
- MoSys' 1T-SRAM-Q Technology Verified on UMC'S 0.13-Micron Logic Process; Foundry's Customers Can Now Access MoSys' Newest High-Density Embedded Memory Technology
- MoSys' 1T-SRAM-R Memory is Silicon-Proven On UMC's 0.13 Micron Logic Process
- Matsushita licenses MoSys one-transistor SRAM for communications ICs
- MoSys 1T-SRAM Macros Now Proven in Multiple Versions of TSMC'S Standard and Triple-Oxide 0.13-Micron Logic Processes
Breaking News
- Optima Launches New IC Security Verification Solution
- SEGGER's product line fully supports Arm Cortex-M85
- Cadence Advances Radar, Lidar and Communications Processing for Automotive, Consumer and Industrial Markets
- Veriest Joins the Global Semiconductor Alliance
- Enhance your High-Density data processing capabilities to new heights with the USB 3.2/ PCIe 3.1/ SATA 3.2 Combo PHY IP Core interface in 28HPC+/HPC process technology
Most Popular
- Menta joins PROMISE Consortium under the Horizon 2020 Initiative of the European Commission
- Accenture Completes Acquisition of XtremeEDA to Expand Silicon Design Capabilities in Canada and US
- Intel Foundry Services Forms Alliance to Enable Design in the Cloud
- Samsung Begins Chip Production Using 3nm Process Technology With GAA Architecture
- Breker Verification Systems Joins RISC-V International as a Strategic Member to Drive Cache Coherency and SoC Integration Verification Methodologies
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |