UMC to port MoSys' one-transistor SRAM cell to advanced logic processes
UMC to port MoSys' one-transistor SRAM cell to advanced logic processes
By Semiconductor Business News
September 24, 2001 (12:01 p.m. EST)
URL: http://www.eetimes.com/story/OEG20010924S0069
HSINCHU, Taiwan--Silicon foundry supplier United Microelectronics Corp. here and memory developer MoSys Inc. of Sunnyvale, Calif., today announced an extension to their cooperation in one-transistor SRAM technology for 0.15- and 0.13-micron logic-IC processes. UMC said it will port MoSys' 1T-SRAM cell to next-generation logic processes after previously verifying the memory technology on its 0.18-micron processes. The one-transistor SRAM cell is expected to be used in system-on-chip designs, which are primarily made up of logic blocks. The 1T-SRAM cell will double the bit density of embedded memory blocks compared to traditional SRAM designs, according to UMC and MoSys. "The combination of UMC's advanced logic processes and MoSys' 1T-SRAM technology provides designers with a strong technology platform for their next generation of SoC products," stated Jean Tien, strategic marketing vice president of UMC.
Related News
- MoSys to port 1T-SRAM-Q technology to UMC's 0.13-micron and 90-nanometer processes
- MoSys' 1T-SRAM-Q Technology Verified on UMC'S 0.13-Micron Logic Process; Foundry's Customers Can Now Access MoSys' Newest High-Density Embedded Memory Technology
- MoSys' 1T-SRAM-R Memory is Silicon-Proven On UMC's 0.13 Micron Logic Process
- Matsushita licenses MoSys one-transistor SRAM for communications ICs
- MoSys 1T-SRAM Macros Now Proven in Multiple Versions of TSMC'S Standard and Triple-Oxide 0.13-Micron Logic Processes
Breaking News
- China's Intel, AMD Ban Helps Local Rivals, Analysts Say
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
Most Popular
- Intel and Arm Team Up to Power Startups
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- Renesas Introduces Industry's First General-Purpose 32-bit RISC-V MCUs with Internally Developed CPU Core
- SmartSoC Solutions Joins TSMC Design Center Alliance to Boost Semiconductor Innovation in India
E-mail This Article | Printer-Friendly Page |