Fortemedia Licenses Tensilica Fusion F1 DSP for Use in Always-On Smart Microphone Processor
SAN JOSE, Calif., January 5, 2017—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that Fortemedia, Inc. has licensed the Cadence® Tensilica® Fusion F1 DSP as the engine of their next-generation smart microphone processor to support always-on voice trigger and sensor fusion capabilities for voice wake-up in mobile, internet of things (IoT) and consumer applications.
By configuring the Fusion F1 DSP to efficiently support voice processing and context-aware sensor fusion, Fortemedia’s latest solution will enable features such as automatic screen shutoff and ringer volume boost while devices are carried in pockets or purses, automatic reading of messages upon entering a car, and ultra-low-power voice triggering.
“The integration of Tensilica’s Fusion F1 DSP into our latest generation SAM101 DSP enables us to offer an extremely low-power solution with improved sensor fusion and voice triggering functions for always-on applications in the consumer market,” said Joseph Chen, vice president, advanced hardware architecture at Fortemedia. “Cadence’s broad software partner ecosystem supporting the Tensilica Fusion F1 DSP provides our customers with an easy way to add additional capabilities.”
“The Fusion F1 DSP enables even lower energy for the always-on features in mobile and other consumer devices and will extend Fortemedia’s advantage over microcontroller based designs,” said Larry Przywara, group director of audio/voice DSP marketing at Cadence. “With the integration of the Tensilica Fusion F1 DSP in their latest smart microphone processor, Fortemedia can now deliver a leading-edge solution to enhance user experiences and speech communication.”
The Tensilica Fusion F1 DSP offers low energy, high performance control and signal processing for a broad segment of IoT/wearable markets. This highly configurable architecture is specifically designed to excel at always-on processing—including wake-on-voice and sensor fusion applications—that require a merged controller plus DSP, ultra-low energy and a small footprint. It can be designed into SoCs for wearable activity monitoring, indoor navigation, context-aware sensor fusion, face trigger, voice trigger and voice recognition.
For more information on the Tensilica Fusion DSP family, visit http://ip.cadence.com/fusion?CMP=TIP_G3_PR_0716.
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers and research facilities around the world to serve the global electronics industry. More information about the company, its products and its services is available at www.cadence.com.
|
Cadence Hot IP
Related News
- Realtek Licenses Cadence Tensilica Fusion DSP to Support Ultra-Low-Power Always-On Functions in the RTS3110/RTS3111 Context Hub Chip
- Rafael Micro Licenses Cadence Tensilica Fusion F1 DSP for Low-Power NB-IoT Modem IC
- Cadence Extends Popular Tensilica Vision and AI DSP IP Product Line with New DSPs Targeting High-End and Always-On Applications
- GEO Semiconductor Selects Cadence Tensilica Vision P5 DSP for Their Most Advanced Automotive Smart Viewing Camera Processor
- Software-Based GPS Receiver from Galileo Satellite Navigation Now Available on Cadence Tensilica Fusion F1 DSP
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |