Samsung claims first ARM design to exceed 1-GHz
![]() |
Samsung claims first ARM design to exceed 1-GHz
By Darrell Dunn, EBN
October 17, 2002 (10:00 a.m. EST)
URL: http://www.eetimes.com/story/OEG20021017S0021
SAN JOSE, Calif. -- Samsung Electronics Corp. at the Microprocessor Forum here today revealed details of what the company claims is the first 1.2-GHz implementation of an ARM processor core. Jin Cheon Kim, director of the processor architecture lab at Samsung, said the core, code named Halla after the highest mountain in South Korea, is pin compatible with the ARM1020E, but provides significant performance advancement beyond that core or the ARM-based XScale from Intel Corp. Kim said the company, which has design experience from making Alpha processors, "is applying our expertise in high speed processors to the ARM design. We have achieved this mostly by circuit level speed-up." The ARM architecture is one of the most widely licensed and implemented embedded processor solutions in the world. Kim said Samsung plans to use Halla system-on-a-chip implementations for its Pocket-PC and digital televisions. Halla is expected to be sampling in t he third quarter of 2003, he said. Improvements included full-custom circuit design and layout, Kim said. Samsung is using dynamic circuits in timing-critical paths, employing dual-rail low-swing buses, and has completely redesigned the control logic, he said. Manufactured in a 0.13-micron process, Kim said the core has 1.8 watts power dissipation at 1.2-GHz, or 550 milliwatts at 800-MHz.
Related News
- Rambus DRAMs exceed 1-GHz speeds
- MIPS rolls out faster 64-bit RISC core, promises 1-GHz at 0.10-micron process
- Startup spins 1-GHz CPU for embedded apps
- Arm-powered Fugaku supercomputer claims #1 spot on Top500 third time in a row
- New DaVinci DM37x video processors from Texas Instruments combine 1 GHz ARM Cortex-A8 and 800MHz C64x+ DSP, enabling 720p HD video for media-rich applications
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |