China Expected to Poach More Taiwan Chip Execs
Alan Patterson, EETimes
1/11/2017 05:30 PM EST
TAIPEI — Chinese chipmakers are likely to hire more Taiwanese semiconductor executives as the administration of incoming U.S. President Donald Trump tightens restrictions on China’s acquisitions of U.S. chip companies, according to a veteran analyst in Asia.
China’s Tsinghua Unigroup, which in recent years has joined other Chinese investors to pursue acquisitions of domestic and overseas chipmakers, this month hired Shih-wei Sun, a former CEO of Taiwan’s United Microelectronics Corp. as an executive vice president for Tsinghua’s global operations.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- China and US Bolster Semiconductor Independence as Taiwan's Foundry Capacity Share Projected to Decline to 41% by 2027, Says TrendForce
- Avant Technology Represents NSITEXE's RISC-V Processor IP Products in Taiwan and China
- SmartDV and NSITEXE Sign Agreement to Deploy NSITEXE's RISC-V 32bit CPU Core throughout North America, China, India, Taiwan
- IC Industry at Heart of Possible China Takeover of Taiwan
- CEVA's 2018 Technology Symposium Series Coming to Taiwan, China and Japan
Breaking News
- Arteris Wins Two Gold and One Silver Stevie® Awards in the 2025 American Business Awards®
- Faraday Adds QuickLogic eFPGA to FlashKit‑22RRAM SoC for IoT Edge
- Xylon Introduces Xylon ISP Studio
- Crypto Quantique announces QRoot Lite - a lightweight and configurable root-of-trust IP for resource-constrained IoT devices
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
Most Popular
- Andes Technology and Imagination Technologies Showcase Android 15 on High-Performance RISC-V Based Platform
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- Synopsys and TSMC Usher In Angstrom-Scale Designs with Certified EDA Flows on Advanced TSMC A16 and N2P Processes
- Certus Semiconductor Joins TSMC IP Alliance Program to Enhance Custom I/O and ESD Solutions
- M31 Collaborates with TSMC to Advance 2nm eUSB2 IP Innovation