Significant IP-core Announcements for Omnitek
BASINGSTOKE, UK. February 7th 2016 – Omnitek, a world leading supplier of FPGA based video IP and turnkey design solutions announces significant new IP releases at Integrated Systems Europe, 7-10 February - RAI Amsterdam, Booth 14-B132.
- HDMI2.0 Tx and Rx - Supporting all resolutions up to 4K60
- V-By-One Tx - Small footprint IP core for direct-drive of 4K display panels
- Image Signal Processor (ISP) - For handling raw camera sensor outputs; Contains defective pixel removal, tone mapping, colour filter array and colour processing
- Image Stitch IP - A fully automatic multi-camera image stitch system with a 4K60 output
- Projector Subsystem - A configurable projector design supporting resolutions from HD video up to 8K processing, with video I/O, de-interlacer, scaler, perspective/keystone warps, OSD, multi-image blending, and 3D support
- Warp IP Enhancements - Extension to include independent RGB warps and fully arbitrary warp mapping
- 8K OSVP - Omnitek has extended its high-quality Scalable Video Processor pipeline to include support for 8K resolutions
The result of investment in R&D and real-world customer designs that Omnitek provides for its extensive customer base, these FPGA IP cores enable low resource, low power, efficient designs to fit in the smallest Xilinx FPGA, SoC and MPSoC devices.
Omnitek CEO Roger Fawcett commented, “Our highly respected R&D team remains committed to an extensive development program of highly optimised IP which exploits all aspects of the world’s leading FPGA devices. At ISE this year we significantly extend our portfolio with no fewer than eight new product announcements for video processing, interconnect and complete sub-system IP”.
Omnitek will be demonstrating the Image Stitch IP and 8K OSVP on the Xilinx booth 14.B132 at ISE.
|
Related News
- SmartDV Delivers New Design IP for Video, Imaging, Entertainment System Protocols
- intoPIX aggressively increases its IP-core portfolio development and salutes the creation of Image Matters by Jean-Francois Nivart
- intoPIX JPEG 2000 technology adopted by NHK Engineering Services for developing a compact 4K high-resolution outdoor acquisition system
- Xilinx Consumer Video Kit Drives Innovation for 3DTV and Other Digital Displays with More Bandwidth and Standards Support
- Xylon Introduces Xylon ISP Studio
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |