4Kx16 Bits OTP (One-Time Programmable) IP, UMC 110 nm 1.2V/3.3V L110AE Process
Rambus Signs License Agreement with Western Digital
New agreement licenses wide use of Rambus inventions in Western Digital Flash products
SUNNYVALE, Calif. – March 6, 2017 – Rambus Inc. (NASDAQ:RMBS) today announced it has signed a broad patent license agreement with Western Digital Corporation, a global storage technology and solutions leader. The agreement covers the use of Rambus patented memory technologies, including high-speed interfaces, memory architectures, resistive memory and security technologies, in Western Digital products through 2021. The agreement also includes an additional 5-year extension option. Specific terms of the agreement were not disclosed.
“With the enormous amount of information flowing through today’s data center applications, memory and interface technologies play a critical role to meet the increasing demands of higher bandwidth and lower latency needs,” said Luc Seraphin, senior vice president and general manager of the Memory and Interfaces division at Rambus. “The lines between non-volatile memory and DRAM have blurred as the increasing performance of traditional NAND Flash has driven the adoption of faster interface architectures. This agreement with Western Digital provides access to our patented memory technologies that address the challenging requirements of modern data centers.”
Rambus develops high-performance, low-power memory and SerDes interface chips and IP cores to meet the needs of increasingly diverse enterprise and mobile applications. Rambus also drives innovations in silicon-to-cloud security, making digital products safer and better.
For additional information on Rambus products and solutions, please visit rambus.com.
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