Startup Taps TSMC to Attack Broadcom
Rick Merritt
3/6/2017 02:25 PM EST
Mediatek takes InFO package to data center
SAN JOSE, Calif. — One of a handful of startups aiming to attack Broadcom’s dominance in Ethernet switching emerges from stealth mode this week. Nephos spun out of Taiwan’s Mediatek and will push packaging technology from TSMC to a new level.
Broadcom held a whopping 94.5% share of the $687 million market for merchant 10–40-Gbit/second Ethernet switch chips in 2015, according to Linley Group analyst Bob Wheeler. Nephos is the latest of three startups to emerge seeking a slice of that pie and one most likely to provide a mainstream alternative, he said.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
- TSMC and Broadcom Enhance the CoWoS Platform with World's First 2X Reticle Size Interposer
- Broadcom Announces Industry's First Silicon-Proven 7nm IP for ASICs in Deep Learning and Networking Applications
- Qualcomm Reportedly Taps TSMC's 7nm
- TSMC taps ARM's V8 on road to 16-nm FinFET
- Former Broadcom, Altera execs form processor startup
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation