Open-Silicon to Showcase its Spec2Chip IoT SoC Platform Solution Consisting of IoT Edge SoC Platform and IoT Gateway SoC Platform at IoT DevCon Santa Clara on April 26-27, 2017
April 10th, 2017 -- Open-Silicon, a system-optimized ASIC solutions provider, will be exhibiting at IoT DevCon in Santa Clara on April 26-27, 2017 to demonstrate its IoT Edge SoC Platform and IoT Gateway SoC Platform. Please visit our booth on the exhibition floor to view the demos and to learn about other innovative ASIC/SoC solutions.
IoT Edge SoC Platform – This demonstrates end-to-end communication between sensor hubs and the cloud through a gateway device. Depending upon the type of radio technology, the sensor hubs can be used outdoors, on the factory floor or inside a room. The industrial IoT system setup is a part of Open-Silicon’s Spec2Chip IoT SoC Platform, which allows IoT edge ASIC designs to be evaluated at the system level. http://www.open-silicon.com/iot-edge-soc-platform/
IoT Gateway SoC Platform – This demonstrates end-to-end communication between edge devices/sensor hubs, gateways and the cloud. The IoT Gateway SoC Platform applications include smart homes, smart waste management, smart transport, smart traffic, smart parking, smart lighting, smart metering and more. Open-Silicon’s booth demonstration will include smart lighting and smart parking in action. This smart city IoT system set up is a part of Open-Silicon’s Spec2Chip IoT SoC Platform, which allows IoT gateway ASIC designs to be evaluated at the system level. http://www.open-silicon.com/iot-gateway-soc-platform/
When:
April 26 (8:30 am – 6:30 pm)
April 27 (8:30 am – 2:30 pm)
Where:
Open-Silicon booth # 11 on the exhibition floor
Santa Clara Convention Center
5001 Great America Parkway
Santa Clara, CA 95054
About Open-Silicon:
Open-Silicon transforms ideas into system-optimized ASIC solutions within the time-to-market parameters desired by customers. The company enhances the value of customers’ products by innovating at every stage of design – architecture, logic, physical, system, software, IP – and then continues to partner to deliver fully tested silicon and platforms. Open-Silicon applies an open business model that enables the company to uniquely choose best-in-industry IP, design methodologies, tools, software, packaging, manufacturing and test capabilities. The company has partnered with over 150 companies, ranging from large semiconductor and systems manufacturers to high-profile start-ups, and has successfully completed 300+ designs and shipped over 125 million ASICs to date. Privately held, Open-Silicon employs over 250 people in Silicon Valley and around the world.
|
Related News
- Open-Silicon to Demonstrate its High Bandwidth Memory (HBM2) IP Subsystem Solution for High Performance Computing and Networking Applications and Showcase its IoT Gateway SoC Reference Design for Smart City Applications at ARM TechCon 2017
- Open-Silicon to Demonstrate and Present on Custom SoC Platform Solutions for AI Applications at the TSMC OIP Event in Santa Clara
- Open-Silicon Announces IoT Gateway SoC Platform
- Open-Silicon to showcase ARM Cortex-M based IoT Custom SoC Platform at ARM TechCon
- Faraday Adds QuickLogic eFPGA to FlashKit-22RRAM SoC for IoT Edge
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |