Semiconductor industry executive with more than 20 years of experience chartered with spearheading new growth strategies and initiatives
MOUNTAIN VIEW, Calif. -- April 19, 2017 -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing IP for smarter, connected devices, today announced the appointment of Mr. Ran Soffer as vice president of marketing and corporate development for the company. A semiconductor industry veteran with more than 20 years of senior management positions at startups through to Fortune 500 corporations, Mr. Soffer brings vast experience to the marketing and corporate development roles at CEVA. Mr. Soffer will join the executive management team, under which he will be responsible for the company's overall growth strategy, including M&A.
Mr. Soffer most recently served as the General Manager of the Microwave Business Unit at Broadcom, following its acquisition of Provigent in 2011, where he served as Vice President of Marketing and Product Management. Mr. Soffer also served as Director of Product Management for Metalink and in various engineering and leadership positions at Motorola, Redux and ECI. Mr. Soffer earned an M.B.A and an M.S. and B.S. in Electrical Engineering from the Israel Institute of Technology.
Gideon Wertheizer, CEO of CEVA, commented: "We warmly welcome Ran to CEVA's executive team. His extensive industry experience and strategic vision will prove invaluable as we seek to leverage on our business success and customer base to expand our market reach and product portfolio."
Mr. Soffer commented: "As someone who has worked successfully with CEVA as a customer, I am thrilled to join such an innovative technology company and become part of the leadership team. I have watched CEVA evolve into a leading, multi-faceted signal processing IP house and look forward to capitalizing on this to further expand and diversify CEVA's business."
About CEVA, Inc.
CEVA is the leading licensor of signal processing IP for a smarter, connected world. We partner with semiconductor companies and OEMs worldwide to create power-efficient, intelligent and connected devices for a range of end markets, including mobile, consumer, automotive, industrial and IoT. Our ultra-low-power IPs for vision, audio, communications and connectivity include comprehensive DSP-based platforms for LTE/LTE-A/5G baseband processing in handsets, infrastructure and machine-to-machine devices, advanced imaging, computer vision and deep learning for any camera-enabled device, audio/voice/speech and ultra-low power always-on/sensing applications for multiple IoT markets. For connectivity, we offer the industry's most widely adopted IPs for Bluetooth (low energy and dual mode), Wi-Fi (802.11 a/b/g/n/ac up to 4x4) and serial storage (SATA and SAS). Visit us at www.ceva-dsp.com.