Dual Port Register File Compiler (1 Read-Only Port, 1 Write-Only Port)
Amlogic Reduces HW/SW Integration Time for Multimedia SoCs by Two Months Using the Cadence Protium S1 FPGA-Based Prototyping Platform
Fast prototype bring-up and congruency with Palladium Z1 Enterprise Emulation Platform enable early software development
SAN JOSE, Calif., 26 Apr 2017 -- Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that Amlogic has adopted the new Cadence® ProtiumTM S1 FPGA-Based Prototyping Platform to deliver multimedia system-on-chip (SoC) designs to market faster. Using the Protium S1 platform, Amlogic accelerated its hardware/software (HW/SW) integration process, resulting in a time savings of two months compared to its previous traditional HW/SW integration method. For more information on the new Protium S1 FPGA-Based Prototyping Platform, visit www.cadence.com/go/protiums1.
Amlogic, an early participant in the Protium S1 platform beta program, found that the platform’s unique implementation and accelerated time to prototype capabilities enabled its engineering team to begin software development on its SoC designs earlier than before. The platform also allowed designers to boot Linux and Android faster and run AnTuTu benchmark scoring in a single day.
“The Protium S1 platform enabled us to successfully run multiple instances of the design in parallel so that we could be much more productive,” said Jerry Cao, software engineering director at Amlogic. “In addition, the platform shares a common compile flow with the Cadence Palladium® Z1 Enterprise Emulation Platform, which allows us to re-use our existing Cadence verification environment and achieve functional congruency between the two platforms.”
The Protium S1 FPGA-Based Prototyping Platform is a next-generation platform that enables early software development, reducing design bring-up time by an average of 80 percent versus traditional FPGA prototyping approaches. The Protium S1 platform further extends the innovation within the Cadence Verification Suite and supports the company’s System Design Enablement strategy, which enables system and semiconductor companies to create complete, differentiated end products more efficiently.
About Cadence
Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence® software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s System Design Enablement strategy helps customers develop differentiated products—from chips to boards to systems—in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine's 100 Best Companies to Work For. Learn more at cadence.com.
|
Cadence Hot IP
Related News
- Hiroshima University Research Team Accelerates the Development of a Computer-Aided Medical Diagnosis System with Cadence Tensilica Vision P6 DSP Core and Protium S1 FPGA-Based Prototyping Platform
- Cadence Launches Protium S1 FPGA-Based Prototyping Platform for Early Software Development
- HyperSilicon Releases Xilinx- XCVU440 Based FPGA-Based Prototyping Platform for VLSI (Very Large Scale Integration)Verification
- Hiroshima University Research Team Accelerates Automotive Algorithm Development with Cadence Protium Rapid Prototyping Platform
- New ARM IP Tooling Suite Reduces SoC Integration Time from Months to Days
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |