Dual Port Register File Compiler (1 Read-Only Port, 1 Write-Only Port)
TSMC Prosecutes Ex-Employee for Leaking Secrets
Alan Patterson, EETimes
5/4/2017 00:01 AM EDT
TAIPEI — Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s largest chip foundry, said it is prosecuting a former employee for leaking intellectual property in its second such case in the past five years.
The employee, who TSMC only identified by his surname, Hsu, printed out what the company called an “abnormal volume” of documents related to the company’s 28nm process technology. The employee also said he planned to resign from TSMC and join rival foundry Shanghai Huali Microelectronics Co. (HLMC).
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
- TSMC Wins Lawsuit Against Ex-Employee Now at Samsung
- ChatGPT leaking Samsung chip secrets is iceberg's tip
- M31 Collaborates with TSMC to Advance 2nm eUSB2 IP Innovation
- Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC's A16 and N2P Process Technologies
- Synopsys and TSMC Usher In Angstrom-Scale Designs with Certified EDA Flows on Advanced TSMC A16 and N2P Processes
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation