ST opts for phase-change memory on 28nm FDSOI
May 11, 2017 // By Peter Clarke, eeNews
STMicroelectronics NV (Geneva, Switzerland) has opted to use phase-change memory as an embedded non-volatile memory option for its 28nm fully-depleted silicon-on-insulator (FDSOI) process.
Jean-Marc Chery, chief operating officer of ST, revealed the development during a presentation at ST's Capital Markets Day held in London, May 11.
ST offers an embedded flash memory option at 40nm and has been working on alternative embedded NVM at 28nm.
Phase-change memory exploits the behaviour of chalcogenide glass that is can be moved reversibly between amorphous and crystalline states with different electrical resisitance. Chery, who has been named as deputy CEO with effect from July 1, said in his presentation that ST is working on PCM-above-IC as its embedded NVM for 28nm. He also said the embedded PCM would meet the most stringent requirements of the automotive industry.
E-mail This Article | Printer-Friendly Page |
|
Related News
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
Most Popular
- Qualitas Semiconductor and Ambarella Sign Licensing Agreement
- ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Intel and Arm Team Up to Power Startups
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024