32-Bit RISC-V Embedded Processor and Subsystem, Maps ARM M-0 to M-4. Optimal PPA,
Israel's Vayyar Imaging Licenses Sonics NoC For Use in 3D Sensor Chips
San Jose, Calif. – May 24, 2017 – Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, today announced that Vayyar Imaging (Tel Aviv, Israel) has licensed SonicsSX® and SonicsExpress™ for use in its 3D sensor chips. Vayyar’s powerful sensor technology (watch video) is revolutionizing breast cancer detection, robotics, smart-home, smart cities, automotive, smart electronic appliances and more. Its sensors see through skin and tissue to detect breast or other cancer masses, look through walls to detect structural foundations, and can track a person’s location and vital signs as they move through a smart home.
“Israel’s top technology innovators continue to adopt Sonics’ NoC technology as the interconnect fabric for their advanced chips and SoCs,” said Grant Pierce, CEO of Sonics. “Vayyar’s goal is to employ its highly sophisticated embedded chip and advanced imaging algorithms to help people worldwide improve their health, safety, and quality of life using mobile, low-cost, and safe 3D imaging sensors. We’re pleased to be an important part of the Vayyar solution.”
“Sonics is the global leader in NoC technology and we chose its products for their track record of success and support for our chip performance and low-power requirements,” said Raviv Malamed, CEO at Vayyar.
About Vayyar
Launched in 2011, Vayyar Imaging’s technology is being used by Fortune 500 companies and is expanding into multiple industries. Designed to see through materials, objects and liquids, Vayyar’s exclusive sensors see through known barriers to deliver an unprecedented imaging experience. The sensors scan the object and create a 3D image of its content. In addition, Vayyar’s 3D image sensing capabilities enable it to detect motion, speed, and track multiple people in large areas. Vayyar’s technology is compact, mobile, and based on low power radio frequency transmissions, and will make imaging technology available anytime, anywhere, at your fingertips. The Israel-based company is privately held and backed by Walden Riverwood, Battery Ventures, Bessemer Venture Partners, Israel Cleantech Ventures (ICV), and Amiti Ventures.
About Sonics, Inc.
Sonics, Inc. (San Jose, Calif.) is the trusted leader in on-chip network (NoC) and power-management technologies used by the world’s top semiconductor and electronics product companies, including Broadcom®, Intel®, Marvell®, MediaTek, and Microchip®. Sonics was the first company to develop and commercialize NoCs, accelerating volume production of complex systems-on-chip (SoC) that contain multiple processor cores. Based on the ICE-Grain™ Power Architecture, Sonics’ ICE-G1™ is the industry’s first complete Energy Processing Unit (EPU), which enables rapid development of SoC power management subsystems. Sonics is also a catalyst for ongoing discussions about design methodology change via the Agile IC Methodology LinkedIn group. Sonics holds approximately 150 patent properties supporting customer products that have shipped more than four billion SoCs. For more information, visit sonicsinc.com.
|
Related News
- Arteris IP FlexNoC Interconnect & Resilience Package Licensed by Vayyar Imaging for ISO 26262-Compliant 3D Imaging Chips for Automotive Systems
- Mediatek Licenses Sonics' NoC and Memory Scheduler IP
- Hynix Licenses Apical's Imaging Cores for its Next Image Sensor Products
- Vayyar Selects Cadence Tensilica Vision DSP for Advanced Millimeter Wave 3D Imaging Radar Solution
- Sonics Partners With SiFive To Support Agile RISC-V SoC Design Platform With IP Industry's Most Widely Used NoCs
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
E-mail This Article | Printer-Friendly Page |