Cadence Digital, Signoff and Custom/Analog Tools Enabled on Samsung's 7LPP and 8LPP Process Technologies
SAN JOSE, Calif., 24 May 2017 -- Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its digital, signoff and custom/analog tools are enabled on Samsung Electronics’ 7LPP and 8LPP process technologies. The 7LPP and 8LPP process technologies continue to deliver power, performance and area optimizations with additional scaling benefits over previous generations of advanced FinFET nodes, and customers can begin working on early designs using these next-generation technologies.
The Cadence custom/analog, digital and signoff tools meet Samsung’s requirements, which can enable foundry customers to create complex, advanced-node mobile and other vertical market designs using Samsung’s 7LPP and 8LPP process technologies. To learn more about the Cadence® digital and signoff solutions, visit www.cadence.com/go/samsung7nm8nmdands. For information about the Cadence custom/analog solutions, visit www.cadence.com/go/samsung7nm8nmcanda.
The digital and signoff tools currently enabled on the Samsung 7LPP process include the Innovus™ Implementation System and Physical Verification System for DRC. The custom/analog tools enabled on the Samsung 7LPP process include the Virtuoso® Advanced-Node Platform, which consists of the Spectre® Accelerated Parallel Simulator (APS), the Spectre Extensive Partitioning Simulator (XPS), the Virtuoso ADE Product Suite, the Virtuoso Layout Suite, and the Virtuoso Schematic Editor. The Quantus™ QRC Extraction Solution and Physical Verification System for Layout Versus Schematic (LVS) and Manufacturability and Variability Solutions (MVS) are expected to be enabled on the 7nm LPP process by the end of June 2017.
The digital and signoff tools currently enabled on the Samsung 8LPP process include the Innovus Implementation System, Quantus QRC Extraction Solution and Physical Verification System. The custom/analog tools enabled on the Samsung 8LPP process include the Virtuoso Advanced-Node Platform, which consists of the Spectre Accelerated Parallel Simulator (APS), Spectre Extensive Partitioning Simulator (XPS), the Virtuoso ADE Product Suite, the Virtuoso Layout Suite, and the Virtuoso Schematic Editor.
“We’ve worked closely with Cadence to ensure that its custom/analog, digital and signoff tools enable customers to quickly and easily experience the benefits of our advanced-node process technologies,” said Jaehong Park, senior vice president of the Foundry Design Team at Samsung Electronics. “Enabling tools early is essential for our customers to deliver designs to their high-volume customers within tight market windows.”
“The Cadence tools that are enabled allow customers to achieve optimized power, performance and area results and remain competitive within their respective markets,” said Dr. Anirudh Devgan, executive vice president and general manager of the Digital & Signoff Group and the System & Verification Group at Cadence. “The close collaboration and efficient working model between Cadence and Samsung Foundry provides customers with confidence that these complex, advanced-node FinFET designs can be implemented quickly.”
About Cadence
Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence® software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s System Design Enablement strategy helps customers develop differentiated products—from chips to boards to systems—in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine's 100 Best Companies to Work For. Learn more at www.cadence.com.
|
Cadence Hot IP
Related News
- Cadence Full-Flow Digital and Signoff Tools Certified on Samsung Foundry's 7LPP Process Technology
- Cadence Full-Flow Digital and Signoff Tools Certified on Samsung's 8LPP Process Technology
- Cadence Full-Flow Digital and Signoff Tools and Custom/Analog Tools Certified and Enabled for Intel 22FFL Process Technology
- Cadence Custom/Analog and Full-Flow Digital and Signoff Tools Enabled for GLOBALFOUNDRIES 7LP Process Node
- Cadence Custom/Analog, Digital and Signoff Tools Achieve Certification on Samsung 28FDS Process Technology
Breaking News
- Fractile raises $15m seed funding to develop radical new AI chip and unlock exponential performance improvements from frontier AI models
- Ceva Bluetooth Low Energy and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor's Balletto Family of MCUs
- Agile Analog delivers customizable IP on GlobalFoundries' FinFet and FDX processes
- Ian Walsh appointed as Sondrel's Regional VP for America
- Systems Designed Today Must Support Post-Quantum Cryptography Tomorrow
Most Popular
- Imagination Technologies announces new capital investment from Fortress Investment Group
- Alphawave Semi: Q2 2024 Trading and Business Update
- Agile Analog delivers customizable IP on GlobalFoundries' FinFet and FDX processes
- Efinix Releases Topaz Line of FPGAs, Delivering High Performance and Low Power to Mass Market Applications
- Comcores supports BAE systems as a key partner with JESD204C IP
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |