English
Apple, Amazon to Join Foxconn's Toshiba Bid
Dylan McGrath, EETimes
6/5/2017 09:01 PM EDT
SAN FRANCISCO—Apple and Amazon will pony up to pay a portion of contract manufacturer Foxconn's bid to acquire Toshiba's semiconductor business as the consumer electronics powerhouses move to secure a steady supply of NAND flash memory, Foxconn's cheif executive told the Nikkei news service.
Apple and Amazon's names have surfaced before in connection with a possible bid to buy the chip unit, which Toshiba is selling to help offset massive losses incurred by its nuclear power business in the U.S. In March, Japan's Yomiuri Shimbun reported that Apple, Google and Amazon all three their hats in the ring as potential suitors.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
Related News
- DoD may push back on Apple's P.A. Semi bid; PowerPC variant designed into many military systems
- Sharp, Motorola Mobility, and Kyocera Join Access Advance's HEVC Advance Patent Pool as Licensees
- Estimated Shipments of iPhone 14 Devices in 2022 Have Been Lowered to 78.1 Million Units Due to Impact of COVID-19 Lockdown on Foxconn's Base in Zhengzhou, Says TrendForce
- Apple, AMD Back TSMC's Tripled Investment, Tech Upgrade in Arizona
- Intel, Micron, and Analog Devices Join MITRE Engenuity's Semiconductor Alliance to Define Principles for Joint Research and Collaboration for a More Resilient U.S. Semiconductor Industry
Breaking News
- Keysight, Synopsys, and Ansys Deliver Radio Frequency Design Migration Flow to TSMC's N6RF+ Process Node
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Leveraging Cryogenics and Photonics for Quantum Computing
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
- Credo at TSMC 2024 North America Technology Symposium
Most Popular
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results