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LSI Logic licenses packaging technology to Taiwan firm
By EBN
September 18, 2001 (5:21 p.m. EST)
URL: http://www.eetimes.com/story/OEG20010918S0044
LSI Logic Corp. said it will license its organic laminate flip chip ball grid array (FPBGA) technology to Taiwan-based Siliconware Precision Industries, Ltd. (SPIL), an IC assembly, test and design provider. The licensing agreement provides SPIL with access to the FPBGA-4L (four layer), FPBGA-HP (high performance) and flxI/O flip chip technologies. LSI Logic said it's FPBGA packaging technology is aimed at high performance ASIC and system-on-a-chip (SoC) designs, designed for use in broadband, networking, computing and storage applications. The FPBGA uses a matrix of solder bumps on the active surface of the chip, which connects to an organic substrate. The use of solder bump interconnects, as opposed to wire bonding, has demonstrated a reduction in simultaneous switching noise of as much as 80%, LSI said. The backside of the chip is directly connected to a copper heat spreader, providing a source for thermal dissipation.