Rambus And Intel Sign New Comprehensive Patent Cross-License Agreement
Rambus And Intel Sign New Comprehensive Patent Cross-License Agreement
LOS ALTOS, Calif. & SANTA CLARA, Calif.--(BUSINESS WIRE)--Sept. 17, 2001--Rambus Inc. (Nasdaq:RMBS) and Intel Corporation today signed a comprehensive patent cross-license agreement that supersedes the prior agreement between the companies.
The new cross-license provides complete patent coverage to Intel for all patents while providing Rambus license coverage necessary for Rambus' high-speed interface businesses. The agreement will have positive material impact on Rambus' current financial quarter that Rambus will discuss during its conference call and web cast at 6 a.m. PDT. Specific terms of the agreement are confidential.
``We have had a long and mutually beneficial relationship with Intel,'' said Geoff Tate, Rambus' chief executive officer. ``As an R&D hub for high-speed interfaces, Rambus' objective is to produce innovations that will benefit the semiconductor and system industries, and by licensing these innovations to generate a return on our investment to our shareholders. We believe the RDRAM standard is the best solution for the majority of the market and our top priority. But as evidenced by this license with Intel, we are pleased to license our other memory, communications and backplane inventions as well.''
``This broad agreement will help Intel continue to be a leader in providing high-performance chipsets,'' said Craig Barrett, Intel president and chief executive officer. ``We also look forward to continued cooperation with Rambus in the further development of RDRAM-compatible chipsets and communications chips as well as the company's support of InfiniBand(a) and future initiatives.''
About Rambus Inc.
Rambus Inc. designs, develops and licenses high-bandwidth chip-connection technology, and provides the comprehensive engineering support necessary for a complete system solution. Rambus' technology and intellectual property are licensed to leading semiconductor suppliers, including DRAM, controller and microprocessor manufacturers, ASIC developers, and foundries for use in computer, consumer and networking systems such as personal computers, workstations, servers, game consoles, set top boxes, digital HDTVs, high-speed switches and routers.
About Intel Corporation
Intel, the world's largest chip maker, is also a leading manufacturer of computer, networking and communications products. Additional information about Intel is available at http://www.intel.com/pressroom.
Note to Editors: Rambus and RDRAM are registered trademarks of Rambus Inc. Intel is a trademark or registered trademark of Intel Corporation or its subsidiaries in the United States and other countries.
Contact:
Rambus Inc.
Kristine Wiseman, 650/947-5319
pr@rambus.com
or
Intel Corporation
Chuck Mulloy, 408/765-3484
chuck.mulloy@intel.com
Related News
- NVIDIA and Intel Sign Broad Cross-License and Chipset License Agreements
- WiLAN and Several Subsidiaries Sign Comprehensive Semiconductor License Agreement with SK hynix
- Rambus and Socionext Sign Broad Patent License Agreement
- Rambus and Marvell Sign Patent License Agreement
- Rambus and Nanya Sign Patent License Agreement
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |