NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
Cadence Announces Legato Memory Solution, Industry's First Integrated Memory Design and Verification Solution
Delivers up to 2X runtime improvement compared to existing point tool solutions
SAN JOSE, Calif. --Sep. 6, 2017 -- Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the Cadence® Legato™ Memory Solution, the industry’s first integrated solution for memory design and verification. The Legato Memory Solution eliminates the complexity of piecing together point tools for multiple design and verification tasks and can lead to productivity gains of up to 2X when compared with previous point tool offerings. To learn more about the Cadence Legato Memory Solution, please visit www.cadence.com/go/memorysolution.
The first-of-its-kind Legato Memory Solution’s cohesive design environment automates design steps and lets customers use the innovative Cadence toolset to deliver products to market faster. The solution includes new patent-pending Cadence Super Sweep technology that utilizes existing simulation databases for multi-corner and Monte Carlo analysis, allowing customers to improve both runtime and simulation throughput.
The technology capabilities included with the Cadence Legato Memory Solution improve overall design productivity and are as follows:
- Bitcell design and verification environment: Customers can design the bitcell, including variation analysis, without ever having to leave the design environment.
- Memory compiler design and verification environment: Customers can design and verify full memory arrays within the Legato Memory Solution and access the new Super Sweep technology to maximize accuracy and simulation throughput for advanced-node designs.
- Memory characterization environment: Customers can create Liberty format models of the memory for system-on-chip (SoC) full-chip analysis. The tight integration between memory characterization and circuit simulation provides additional accuracy and performance improvements that can’t be achieved by point tools.
“As a world-leading supplier of System-on-Chip solutions, focused on imaging, networking and computing technologies that drive a wide variety of applications, it is critical that we accurately simulate memory instances to minimize area and power consumption of System-on-Chip,” said Yoshifumi Okamoto, corporate executive vice president & CTO at Socionext. “Through our use of the Cadence Legato Memory Solution, we have experienced a 2X productivity gain when compared with our point solution and successfully taped out 12nm memory macro designs for our System-on-Chip solutions, and we can confirm good correlation between simulation result and silicon measurement.”
“Long simulation times and a high rate of inaccuracy have become bottlenecks in the SoC design cycle schedule,” said Tom Beckley, senior vice president and general manager of the Custom IC & PCB Group at Cadence. “The new Legato Memory Solution combines patented technologies interleaved with our existing, proven Virtuoso® Liberate™ MX Memory Characterization Solution, Spectre® eXtensive Partitioning Simulator (XPS) and Virtuoso Variation Analysis solutions to improve designer productivity and enable our customers to meet stringent design schedules.”
About Cadence
Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence® software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s System Design Enablement strategy helps customers develop differentiated products—from chips to boards to systems—in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine's 100 Best Companies to Work For. Learn more at www.cadence.com.
|
Cadence Hot IP
Related News
- Cadence Enables Next-Gen AI and HPC Systems with Industry's Fastest HBM4 12.8Gbps IP Memory System Solution
- Cadence Unveils New Palladium Z2 Apps with Industry's First 4-State Emulation and Mixed-Signal Modeling to Accelerate SoC Verification
- DB GlobalChip Deploys Cadence's Spectre FX and AMS Designer, Accelerating IP Verification by 2X
- OmniVision Announces World's First Dedicated Driver Monitoring System ASIC With Integrated AI Neural Processing Unit, Image Signal Processor and DDR3 Memory
- Cadence Announces Industry's First Verification IP for PHY Covering Multiple Protocols
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |