Ultra-low power 32 kHz RC oscillator designed in GlobalFoundries 22FDX
OmniPHY to Demonstrate Automotive Design Solutions at TSMC 2017 OIP Ecosystem Forum
September 8, 2017 -- OmniPHY Semiconductor, Inc. today announced it will be showcasing how it leverages TSMC manufacturing technology to create robust automotive semiconductor IP solutions at the TSMC 2017 Open Innovation Platform® Ecosystem Forum. The event is being held on September 13, 2017, at the Santa Clara Convention Center.
What:
OmniPHY will be showcasing its IP solutions, including:
- Automotive Ethernet IP and Connectivity Solutions: Automotive Ethernet is a new standard that will be the backbone of the in-car network powering vehicles to become autonomous ‘Servers with Wheels.’ The first designs support 100 Mb communications over a single pair of unshielded twisted pair. Come see a live demonstration of this exciting new technology. Additionally, OmniPHY will be discussing its brand new Automotive Switch technology. Engineers will be on hand to describe how we create IP for the automotive market.
- Industrial Ethernet: OmniPHY has developed a unique multiprotocol Ethernet PHY design that features deterministic (and low) latency, the most advanced diagnostics, and support for extended temperatures handling rugged conditions and vibrations. Customers are introducing this IP into their own industrial SOC’s and enabling the Industrial IoT.
- Enabling the Cloud: Compelling SerDes designs for the enterprise market with support for 100G Ethernet backplane/twinax cable, and the 28G Common Electrical Interface (CEI) standards satisfying the growing bandwidth needs for the Cloud Datacenters
In addition, experts from our design and applications teams will be on hand to answer questions and engage in technical dialog.
When:
TSMC's OIP Forum is on September 13, 2017 from 8:00am -6:00pm.
Where:
Santa Clara Convention Center, Booth #420
About the TSMC Open Innovation Platform (OIP)® Forum
This event is for TSMC’s OIP Alliance members to present to TSMC customers and for registered attendees only. Please contact your TSMC representative for registration details.
About OmniPHY:
OmniPHY is a leading provider of highly specialized interface IP and communication technology, offering customers greater design margins and fast time-to-market for emerging standards, including 1.25-28 GB/s PHY designs and 10/100/1000BASE-T Ethernet in advanced processes. The company serves the Automotive, Industrial, and Enterprise segments through its lineup of silicon-proven PHY IP.
For more info: http://www.omniphysemi.com/
|
Related News
- OmniPHY to Demonstrate Automotive Design Solutions at TSMC 2016 OIP Ecosystem Forum
- Analog Bits to Demonstrate Automotive Grade IP's Including a Novel High Accuracy Sensor at TSMC 2023 North America Open Innovation Platform Ecosystem Forum
- M31 Technology Wins Customers' Choice Award for Automotive IP Paper at TSMC Open Innovation Platform (OIP) Ecosystem Forum
- Analog Bits to demonstrate Low Power SERDES at TSMC's Open Innovation Platform Ecosystem Forum
- True Circuits Attends the TSMC 2017 China OIP Ecosystem Forum
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |