SEMI Reports Second Quarter 2017 Worldwide Semiconductor Equipment Figures; Record Quarterly Billings of $14.1 Billion
MILPITAS, Calif. — September 11, 2017 — SEMI, the global industry association representing the electronics manufacturing supply chain, today reported that worldwide semiconductor manufacturing equipment billings reached US$14.1 billion for the second quarter of 2017.
Quarterly billings of US$14.1 billion represent an all-time historic record for quarterly billings, exceeding the record level set in the first quarter of this year. Billings for the most recent quarter are 8 percent higher than the first quarter of 2017 and 35 percent higher than the same quarter a year ago. Sequential regional growth was mixed for the most recent quarter with the strongest growth exhibited by Korea. Korea maintained the largest market for semiconductor equipment for the year, followed by Taiwan and China. The data are gathered jointly with the Semiconductor Equipment Association of Japan (SEAJ) from over 95 global equipment companies that provide data on a monthly basis.
The quarterly billings data by region in billions of U.S. dollars, quarter-over-quarter growth and year-over-year rates by region are as follows:
2Q2017 | 1Q2017 | 2Q2016 | 2Q2017 / 1Q2017 (Qtr-over-Qtr) | 2Q2017 / 2Q2016 (Year-over-Year) | |
Korea | 4.79 | 3.53 | 1.53 | 36% | 212% |
Taiwan | 2.76 | 3.48 | 2.73 | -21% | 1% |
China | 2.51 | 2.01 | 2.27 | 25% | 11% |
Japan | 1.55 | 1.25 | 1.05 | 24% | 47% |
North America | 1.23 | 1.27 | 1.20 | -3% | 3% |
Europe | 0.66 | 0.92 | 0.37 | -29% | 76% |
Rest of World | 0.62 | 0.63 | 1.31 | -1% | -53% |
Total | 14.11 | 13.08 | 10.46 | 8% | 35% |
Source: SEMI (www.semi.org) and SEAJ (http://www.seaj.or.jp)
The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports: the monthly SEMI Billings Report, which offers a perspective of the trends in the equipment market; the monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and 24 market segments; and the SEMI Semiconductor Equipment Forecast, which provides an outlook for the semiconductor equipment market. For more information or to subscribe, please contact SEMI customer service at 1.877.746.7788 (toll free in the U.S.) or 1.408.943.6901 (International Callers). More information is also available online: www.semi.org/en/MarketInfo/EquipmentMarket.
About SEMI
SEMI® connects over 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. FlexTech and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org
|
Related News
- SEMI Reports First Quarter 2017 Worldwide Semiconductor Equipment Figures; Record Quarterly Billings of $13.1 Billion
- SEMI Reports Second Quarter 2015 Worldwide Semiconductor Equipment Figures; Billings US$9.4 Billion
- SEMI Reports Second Quarter 2012 Worldwide Semiconductor Equipment Figures; Billings US$ 10.3 Billion
- Second Quarter 2021 Global Semiconductor Equipment Billings Surge 48% Year-Over-Year to Record High of $24 Billion, SEMI Reports
- Worldwide Semiconductor Equipment Billings Reach $16.7 Billion in Second Quarter 2018, SEMI Reports
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |