Ultra-low power 32 kHz RC oscillator designed in GlobalFoundries 22FDX
Rambus Announces Industry's First Functional Silicon of Server DIMM Buffer Chipset Targeted for Next-generation DDR5
Provides data center architects early path to next-generation memory speeds
SUNNYVALE, Calif. – Sept. 20, 2017 – Rambus Inc. (NASDAQ: RMBS) today announced functional silicon of a double data rate (DDR) server DIMM (dual inline memory module) buffer chipset prototype for the next generation DDR5 memory technology. This represents a key milestone for Rambus and the industry’s first silicon-proven memory buffer chip prototype capable of achieving the speeds required for the upcoming DDR5 standard.
“Data-intensive applications like Big Data analytics and machine learning will be key drivers for the adoption of DDR5, with enterprise close behind,” said Luc Seraphin, senior vice president and general manager of the Rambus Memory and Interfaces Division. “We are proud to provide an early path to adoption with the first working buffer chip prototype running at the anticipated performance of next-generation DDR5. This demonstrates our continued dedication to be first to market and remaining on the leading edge of industry standards.”
According to JEDEC, next-generation DDR5 memory will offer improved performance and power efficiency, providing double the bandwidth and density over DDR4. With that, server DIMM chipsets, like registered clock drivers and data buffers, will be critical to enabling higher memory capacities while maintaining peak performance. This Server DIMM chip prototype leverages the signal integrity and low power, mixed-signal design expertise of Rambus to enable development of next-generation solutions for future data center workloads.
For additional information on our Server DIMM Chipsets, please visit rambus.com/dimmchipset.
|
Related News
- Synopsys Announces Industry's First JEDEC DDR5 Verification IP for Next-Generation DRAM/DIMM Designs
- Rambus Expands Chipset for Advanced Data Center Memory Modules with DDR5 Server PMICs
- Infineon's HYPERRAM™ 3.0 memory and Autotalks' 3rd generation chipset drive next-generation automotive V2X applications
- Synopsys Announces Industry's First DDR5 NVDIMM-P Verification IP for Next-generation Storage-class Memory Designs
- Toshiba Designs Altera's Programmable Platform into Its Next-Generation Flash Memory Video Server
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |