Gridbee Launches First FSK & OFDM Sub-GHz System-On-Chip compliant IEEE 802.15.4g/u/v for Smart Grid, Smart Cities and Industrial IoT Applications
GRASSE, France -- September 28, 2017 -- Gridbee Communications S.A.S. specialist in wireless communication IC development is pleased to announce the release of its GDB1000 SoC for Sub-GHz wireless communication solution and compliant with IEEE 802.15.4g/u/v. This is the first SoC capable of both FSK / OFDM modulations and embedding all processing power (MCU and flash memory) necessary for Smart Grid, Smart Cities and Industrial applications. The device provides 2 power amplifier outputs (one internal PA delivering + 18dBm and a second for external PA up to +30dBm) and exhibits a receiver sensitivity of -98dBm @800kb/s and -104dBm @400kb/s OFDM data rate. The high link budget guarantees successful communication over 2.5km distance at 800kb/s.
Gridbee GDB1000 offers both MR-FSK and MR-OFDM modulations and supports data rate from 50kb/s up to 800kb/s for distance ranging from few hundreds of meters to a few kilometers. GDB1000 features a large amount of memory (768kB of flash, 128kB of RAM), a full set of standard interfaces (USB, SPI, I²C, UART, etc.) and a 256 bits capable hardware AES encryption engine enabling secured, fast and reliable software upgrade over the air. Leveraging the high performance, power efficient capabilities of the GDB1000 processor, customers can run a very efficient and secure mesh network while processing data from the edge allowing for faster decision making.
"We are delighted to have reached this key technical milestone. We have enabled our global smart metering customers further with this state of the art SoC. The GDB1000 anticipates and enables more data exchange in IoT applications and our chip will have strong demand from multiple different applications," said, Stephane Laurent, VP Sales & Marketing and co-founder.
Evaluation kits have been sampled to lead customer in India and Korea and starting end of Q3 2017 for general customers.
For more information, see http://www.gridbeecom.com
|
Related News
- Telink Semiconductor Launches World's First All-in-One System-on-Chip for the Internet of Things
- Accent Announces Company Strategic Focus to Speed Adoption of Smart Grid Devices
- Vidatronic Launches New 22 nm Analog IP For Ultra-Low-Power, System-On-Chip Physical Attack Mitigation In Internet Of Things (IoT) Applications
- VeriSilicon's Artificial Intelligence Processor IP Used in Next-Generation Large Screen Smart Home System-on-Chip (SoC)
- Inside Secure's Root of Trust Engine Secures eWBM's System-on-Chip for IoT Market
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |